High-Quality PCB Manufacturing & Assembly Services for Custom PCB Board Solutions

As a leading manufacturer of advanced interconnect solutions for medical devices, Telecom, Industrial, Automotive and Computing.  Benchuang Electronics specializes in flexible, rigid-flex, rigid technologies and pcb assembly, providing highly complex HDI or ultra HDI PCB, high frequency and high reliability printed circuit boards for medical, high frequency and semiconductor applications. Our flexible printed circuits offer reliable performance and durability, meeting the demanding requirements of IPC Class 3 standards with a focus on technical excellence.

Our PCB Manufacturing Capabilities

PCB Product Type	Minimum Line Width/Space	Minimum Hole/Microvia Diameter	Layer Range	Core Material	Surface Finish Options	Application Scenarios
Standard PCB board	3/3mil	0.2mm (standard via)	2-100L	FR-4	HASL, ENIG, OSP, Immersion Tin	Consumer electronics, industrial controllers, smart home devices
HDI PCB	2/2mil	0.1mm (blind/buried microvia)	4-100L	High-Tg FR-4, Rogers 4000 series	ENIG, Immersion Silver, ENEPIG	Medical devices, 5G telecom modules, portable wearables
Flexible PCB board	2/2mil	0.15mm	1-30L	Polyimide (PI), LCP	ENIG, Coverlay, Solder Mask	Automotive ADAS sensors, wearable tech, aerospace wiring
Rigid-Flex PCB	2/2mil	0.15mm (flex zone) / 0.2mm (rigid zone)	2-20L (rigid) + 1-6L (flex)	FR-4 + Polyimide	ENIG, Immersion Tin	3D device assemblies, EV battery management systems (BMS), medical implants
HDI Rigid-Flex PCB	2/2mil	0.1mm (blind/buried microvia)	4-100L	FR-4 + Polyimide	ENIG, Immersion Silver, ENEPIG	Medical devices, 5G telecom modules, portable wearables
Custom printed circuit board	1/1mil (ultra-fine)	0.08mm (custom microvia)	1-40L	FR-4, Rogers, Biocompatible PI	Customized (per project demand)	Aerospace systems, medical diagnostic tools, high-frequency radar

Every PCB manufacturing workflow for the product categories above adheres to IPC-A-600 quality benchmarks, with scalable lead times tailored to prototype batches (1–100 units) and large-scale production runs (100,000+ units). We also maintain full raw material traceability and furnish comprehensive compliance documentation—including RoHS, REACH, AEC-Q200 for automotive-grade products, and FDA certifications for medical devices—to satisfy industry-specific regulatory mandates. For engineering teams and procurement specialists vetting PCB fabrication partners, this technical matrix clarifies critical performance thresholds across product lines. When selecting a supplier, aligning these parameters with your device’s operational demands and spatial limitations is non-negotiable. For instance, flexible PCBs are indispensable for vibration-intensive automotive ADAS applications, whereas HDI PCBs are a prerequisite for miniaturized 5G modules where component packing density is a top design priority.

Standard PCB Board Fabrication

We deliver consistent, high-yield standard PCB fabrication for consumer electronics and industrial control systems. Our manufacturing process supports 2–100 layer architectures, 3/3mil line width/space specifications, and 0.15mm minimum hole diameters, with surface finish options spanning HASL, ENIG, and OSP. All standard printed circuit boards comply with IPC-A-600 standards, with flexible lead times optimized for both rapid prototype iterations and mass production deployments.

HDI PCB with Microvia Technology

Our HDI PCB solutions leverage advanced blind and buried microvia technology, engineered specifically for compact medical devices and high-performance 5G telecom hardware. These circuit boards accommodate 4–32 layer designs, 2/2mil line width/space, and 0.1mm microvia diameters—enabling a 30% higher component density than conventional PCBs while preserving signal integrity for high-speed data transmission. We employ precision laser drilling to create microvias, ensuring compliance with the stringent quality benchmarks required for high-end electronic products.

Flexible & Rigid-Flex PCB Solutions

We specialize in flexible and rigid-flex PCB manufacturing for automotive ADAS sensors, wearable electronics, and aerospace applications. Our flexible printed circuit boards achieve a bending radius as low as 0.5x the board thickness, paired with 2/2mil line width/space and 0.15mm minimum hole sizes. Protective coverlay layers can be integrated to enhance durability, while rigid-flex variants combine the flexibility of flex circuits with the structural stability of rigid PCBs, ideal for 3D device assemblies that demand both form and function.

Custom Printed Circuit Board Services

Our custom PCB fabrication caters to unique, high-complexity requirements—from 1/1mil ultra-fine line structures for semiconductor test fixtures to 40-layer designs for aerospace avionics systems. We offer tailored solutions with customizable material selections (FR-4, Rogers high-frequency substrates, polyimide) and specialized processes such as ±3% impedance control and back drilling to eliminate signal stubs. Our in-house engineering team provides comprehensive Design for Manufacturability (DFM) consulting, transforming complex PCB designs into production-ready, high-reliability products.

Professional PCB Assembly Services

SMT & Through-Hole PCB Assembly

We provide end-to-end PCB assembly services, encompassing Surface Mount Technology (SMT) for 01005-sized passive components and through-hole insertion for large, heavy-duty connectors. Automated placement equipment ensures 99.9% component placement accuracy, while dedicated manual assembly stations handle delicate oversized parts that require precision handling. For mixed-technology projects, we seamlessly integrate SMT and through-hole processes to meet the assembly needs of consumer and industrial electronics alike.

High-Precision BGA/QFN Assembly

Our high-precision assembly capabilities include soldering for Ball Grid Array (BGA), micro-BGA (0.2mm pitch), and Quad Flat No-leads (QFN) packages—critical for high-performance computing (HPC) and 5G infrastructure devices. We utilize 3D X-ray inspection to verify the integrity of hidden solder joints, paired with nitrogen-reflow ovens to minimize oxidation during the soldering process. This assembly service also supports Package-on-Package (PoP) and Chip Scale Package (CSP) configurations, catering to cutting-edge PCB designs that demand miniaturization and high reliability.

IPC-Class Assembly Quality

All our printed circuit board assembly operations comply with IPC Class 2 (commercial-grade) and IPC Class 3 (high-reliability) standards. We implement 100% Automated Optical Inspection (AOI) to detect surface defects, coupled with functional testing for mission-critical products used in aerospace, medical, and automotive industries. Full traceability is maintained from component lot codes to final shipment, with compliance to FDA regulations, IATF 16949 (automotive), and AS9100 (aerospace) standards.

Our PCB Manufacturing Advantages

Advanced PCB Production Equipment

Our manufacturing facility is equipped with state-of-the-art laser drilling systems (3μm positioning precision), Laser Direct Imaging (LDI) equipment for ultra-fine line patterning, and automated solder paste printers for PCB assembly preparation. The LDI system eliminates traditional film exposure errors, while laser drillers create 30μm microvias essential for HDI PCB production. We efficiently handle small-batch prototype orders (1–100 units) and large-volume manufacturing runs (100,000+ units), ensuring consistent quality across all order sizes.

IPC & IATF Certified Production

As a certified PCB manufacturer, we hold IPC-A-600, IPC-610, IATF 16949 (automotive), and ISO 13485 (medical device) certifications. Our circuit board manufacturing process includes rigorous raw material testing and electrostatic discharge (ESD) protective packaging, ensuring full traceability for every product. These credentials make us a trusted partner for regulated industries where quality and compliance are paramount.

Industry-Specific PCB Solutions

Automotive Flexible Circuit Board

Our flexible circuit boards for automotive ADAS, infotainment systems, and BMS meet AEC-Q200 standards, with an operating temperature range of -40°C to 125°C and 20G vibration resistance. These boards use flame-retardant polyimide substrates with integrated EMI shielding, while BMS-specific flexible PCBs feature 3mm×3mm copper coin reinforcements to handle high-current power paths.

Medical Custom PCB Board

Our custom PCBs for medical devices utilize USP Class VI polyimide and adhere to IPC Class 3 quality standards, complying with FDA 21 CFR Part 820 and CE MDR regulations. Diagnostic tool PCBs support a standby current of ≤10mW for low-power operation, while implantable device PCBs incorporate hermetic sealing to prevent fluid contamination. All medical PCB assembly is performed in a Class 10,000 cleanroom environment to meet strict hygiene requirements.

5G Telecom PCB Circuit

Our 5G base station PCBs use Rogers RO4350B and Taconic TLY-5 substrates—materials with low dielectric constant (Dk) and dissipation factor (Df)—to minimize signal loss in the 24–40GHz mmWave frequency band. These boards feature ±3% impedance control and back drilling to eliminate signal stub noise, with 6+N+6 HDI layer structures optimized for high-density 5G antenna arrays and transceiver modules.

PCB FAQs & Technical Glossary

PCB Manufacturing vs. Assembly

PCB Manufacturing (PCB Fab/Fabrication) involves creating bare PCB boards through substrate cutting, copper etching, drilling, and surface finishing. PCB Assembly (Printed Circuit Assembly) is the subsequent process of soldering electronic components onto bare boards to produce functional circuit assemblies. Our one-stop service model eliminates supply chain bottlenecks and reduces overall lead times for our clients.

Key PCB Technical Terms

• HDI PCB: High-Density Interconnect PCB featuring microvias and fine-pitch traces, designed for miniaturized devices such as smartphones, medical wearables, and 5G modems.
• ENIG Surface Finish: Electroless Nickel Immersion Gold—a corrosion-resistant coating applied to PCB surfaces to enhance solderability and long-term reliability, ideal for high-reliability applications like aerospace and medical devices.
• Blind/Buried Via: Specialized HDI PCB vias that connect partial board layers. Blind vias link outer layers to inner layers, while buried vias connect inner layers exclusively. Both reduce board size and improve signal integrity by eliminating unnecessary through-vias.
• IPC Class 3: The highest PCB quality standard defined by the IPC, reserved for critical applications such as aerospace, military, and life-saving medical devices. It mandates strict defect tolerance and rigorous performance testing.