{"id":4991,"date":"2024-12-30T04:13:31","date_gmt":"2024-12-29T20:13:31","guid":{"rendered":"https:\/\/hdicircuitboard.com\/hdi\/"},"modified":"2025-04-28T20:40:00","modified_gmt":"2025-04-28T12:40:00","slug":"hdi","status":"publish","type":"page","link":"https:\/\/hdicircuitboard.com\/en-ca\/hdi\/","title":{"rendered":"HDI"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"4991\" class=\"elementor elementor-4991 elementor-39\" data-elementor-settings=\"{&quot;ha_cmc_init_switcher&quot;:&quot;no&quot;}\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c601506 e-flex e-con-boxed e-con e-parent\" data-id=\"c601506\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c45eade elementor-widget elementor-widget-heading\" data-id=\"c45eade\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<div class=\"elementor-heading-title elementor-size-default\">HDI PCB: Any layer hdi pcb, Ultra hdi pcb<\/div>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-02f8ef2 elementor-widget elementor-widget-text-editor\" data-id=\"02f8ef2\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<ul>\n<li>High frequency low loss PCB material<\/li>\n<li>Low loss high speed PCB materials<\/li>\n<li>R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material<\/li>\n<li>EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material<\/li>\n<li>High-Density Interconnect, or HDI PCB, are using microvias , via in pads and smaller trace\/space to provide a higher signal density and superior signal integrity<\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0f9d694 e-flex e-con-boxed e-con e-parent\" data-id=\"0f9d694\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-0b2223e e-con-full e-flex e-con e-child\" data-id=\"0b2223e\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-007bc00 elementor-widget elementor-widget-image\" data-id=\"007bc00\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"657\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-fabrication.webp\" class=\"attachment-full size-full wp-image-4998\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-fabrication.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-fabrication-300x192.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-fabrication-768x493.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-fabrication-600x385.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-31dfe07 e-con-full e-flex e-con e-child\" data-id=\"31dfe07\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d5168c7 elementor-widget elementor-widget-heading\" data-id=\"d5168c7\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">HDI PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-19c8c2e elementor-widget elementor-widget-text-editor\" data-id=\"19c8c2e\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). There are different types of HDI features, type I, type II and type III as defined in IPC-2226. <\/p>\n<p><a href=\"https:\/\/hdicircuitboard.com\/en-ca\/\">High Density Interconnect<\/a> (HDI) printed circuit boards (PCB) have a much higher circuit density compared to standard PCBs, which means more components can be placed on a smaller area. This is achieved by reducing trace widths, increasing layer counts, adding stacked \/ staggered \/ blind \/ buried vias, and using finer lines and spaces. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-dadf513 elementor-widget elementor-widget-default\" data-id=\"dadf513\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Show More<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>They are typically more expensive than standard PCBs due to the more complex manufacturing process and the use of specialized materials. The following are some key design considerations that need to be understood by the PCB designer as they need to be confident that their PCB fabricator understands the challenges around the high-technology circuit boards.<\/p><p>Benchuang Electronics has the capabilities and experience to take on all jobs \u2014 including high density interconnect (HDI) fabrication and manufacturing. HDI PCBs have become increasingly popular and are used in a wide variety of industries, including medical, military, and aerospace. They are found most notably in smartphones, tablets, and other digital devices.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9e604f7 e-flex e-con-boxed e-con e-parent\" data-id=\"9e604f7\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-bb65160 e-con-full e-flex e-con e-child\" data-id=\"bb65160\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3a6ad46 elementor-widget elementor-widget-heading\" data-id=\"3a6ad46\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">HDI Multilayer PCB Capabilities<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-bfc449c elementor-widget elementor-widget-text-editor\" data-id=\"bfc449c\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>An HDI board requires smaller vias to make layer transitions, particularly in fine-pitch BGA components and more traces per sq. mm. In order to accommodate fine-pitch components, you&#8217;ll find the following typical features in an HDI layout:  <\/p>\n<p>Smaller vias: HDI boards use microvias (mechanically or laser drilled), blind\/buried, and staggered vias for layer transitions. These vias have smaller aspect ratios than typical through-hole vias. In order to use these vias with finer pitch components, their diameters are smaller, which then limits their useful depth.  <\/p>\n<p>Thinner traces: The thinner traces used in HDI boards are required to make connections to vias on each layer, as well as to in-pad vias. The thinner traces also allow higher trace density, thus the term HDI. <\/p>\n<p>Higher layer count: We&#8217;ve built non-HDI boards with high layer counts, but HDI board layer counts can easily reach 20 or more layers when working with high pin density components (e.g., FPGAs).<\/p>\n<p>Lower signal levels: HDI boards are not used for high voltage or high current. This is because the high field strength between neighboring lines will cause ESD, and high currents will cause excessive temperature rise in conductors. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-43a56e0 e-con-full e-flex e-con e-child\" data-id=\"43a56e0\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-84cc102 elementor-widget elementor-widget-heading\" data-id=\"84cc102\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">HDI PCB Design Guidelines<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0b66a14 elementor-widget elementor-widget-heading\" data-id=\"0b66a14\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Download our design guidelines for HDI PCBs<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-666e514 elementor-widget elementor-widget-text-editor\" data-id=\"666e514\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.<\/p>\n<p>The file lists some of the fabrication features that are typically associated with HDI. The feature limits listed are not comprehensive; Our experienced engineers have also worked with every type of PCB material, so they have the knowledge and expertise to provide recommendations and answer all of your HDI PCB questions. Most importantly, they know how to assist for manufacturability and the potential cost drivers of a project.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ab7d6f6 style-table-container ha-adt-x-scroll-yes elementor-widget elementor-widget-ha-advanced-data-table happy-addon ha-advanced-data-table happy-addon-pro\" data-id=\"ab7d6f6\" data-element_type=\"widget\" data-widget_type=\"ha-advanced-data-table.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\n\t\t<table class=\"ha-advanced-table\" data-widget-id=\"ab7d6f6\" data-search=\"false\" data-paging=\"false\">\n\t\t\t<thead class=\"ha-advanced-table__head\">\n\t\t\t\t<tr class=\"ha-advanced-table__head-column\">\n\t\t\t\t\t\t\t\t\t\t\t<th class=\"ha-advanced-table__head-column-cell\">Description<\/th>\n\t\t\t\t\t\t\t\t\t\t\t<th class=\"ha-advanced-table__head-column-cell\">Production<\/th>\n\t\t\t\t\t\t\t\t\t\t\t<th class=\"ha-advanced-table__head-column-cell\">Advanced<\/th>\n\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t<\/thead>\n\n\t\t\t<tbody class=\"ha-advanced-table__body\">\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Structure<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">3+n+3 (8+N+8 MAX)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">9+N+9<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Layer Count<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2~80L<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">100L<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min. Board thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.005\" (+\/-10%)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.005\" (+\/-10%)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Max. Board thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.300\" (+\/-10%)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.350\" (+\/-8%)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">BGA Pitch<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">8mils (0.2mm)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">6mils (0.15mm)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min.BGA pad\/space<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">7mils\/3mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">5mils\/2mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><b>Materials for build up<\/b><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Prepreg (FR4 1067\/1086\/2113)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Prepreg (ceramics Ro4350)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Laser Drillable Prepreg<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">laser Drillable core (FR4, PI, PTFE, ceramics)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Yes<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">laser Drillable Min.Dielectric thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1.5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">laser Drillable Max.Dielectric thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">4mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><b>Laser via<\/b><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min \/ Max<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2.5mils \/ 6mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2mils \/ 6mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min via edge to via dege space<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">6mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">True position Tolerance<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">+\/-1mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">+\/-1mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><b>Drilling<\/b><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min. Drilled blind via diameter (as drilled)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">6mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min via edge to via dege space (as drilled)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">8mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">7mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><b>PTH Design<\/b><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Blind via aspect ratio (dielectric thickness\/ Laser drill hole size)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.8<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Blind via plating thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.3~1mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.3~1mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Capture pad A\/R<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2.5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Laser via Fill Material<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Epoxy resin\/Copper paste<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Epoxy resin\/Copper paste<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Blind via aspect ratio (as drilled) (dielectric thickness\/ drilling hole size)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.5<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.5<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Blind via plating thickness (as drilled)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">0.8mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1.0mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Capture pad A\/R (as drilled)<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">3mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><b>Outer Layer<\/b><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min. Trace\/Space<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2mils \/ 2mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1.5mils \/ 1.5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min. pad over drill size<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">6mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Max. Copper thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">12 oz<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">30 oz<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Line\/ pad to board edge<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">8mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">7mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Line Tolerance<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">+\/-15%<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">+\/-10%<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><b>Inner Layer<\/b><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\"><\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min.Trace\/Space<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1.5mils \/ 1.5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1.2mils \/ 1.5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min. Copper Thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1\/3oz<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1\/7 oz<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Max. Copper Thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">10oz<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">12oz<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Min. Core Thickness<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">2mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">1.5mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Line\/ pad to drill hole<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">7mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">6mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Line\/ pad to board edge<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">8mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">7mils<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">Line Tolerance<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">+\/-10%<\/td>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<td class=\"ha-advanced-table__body-row-cell\">+\/-10%<\/td>\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t\t\t<tr class=\"ha-advanced-table__body-row\">\n\t\t\t\t\t\t\t\t\t\t\t<\/tr>\n\t\t\t\t\t\t\t<\/tbody>\n\t\t<\/table>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8261839 table-view-more-button elementor-widget elementor-widget-heading\" data-id=\"8261839\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">View More +<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e69f1cd elementor-widget elementor-widget-button\" data-id=\"e69f1cd\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/HDI-PCB-capabilities.xlsx\" target=\"_blank\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><g id=\"Frame\"><path id=\"Vector\" fill-rule=\"evenodd\" clip-rule=\"evenodd\" d=\"M12.5 15L6.5 8.99999H10.5V3.5H14.5V8.99999H18.5L12.5 15Z\" fill=\"#2C53A2\" stroke=\"#2C53A2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path id=\"Vector_2\" d=\"M21.5 19H3.5\" stroke=\"#2C53A2\" stroke-linecap=\"round\"><\/path><path id=\"Vector_3\" d=\"M17.5 22.5H7.5\" stroke=\"#2C53A2\" stroke-linecap=\"round\"><\/path><\/g><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">HDI PCB Design Guidelines<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d7ebffe e-flex e-con-boxed e-con e-parent\" data-id=\"d7ebffe\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-aa5f1f4 e-con-full e-flex e-con e-child\" data-id=\"aa5f1f4\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4d39140 elementor-widget elementor-widget-image\" data-id=\"4d39140\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"1024\" height=\"816\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-circuit-board.webp\" class=\"attachment-full size-full wp-image-4997\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-circuit-board.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-circuit-board-300x239.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-circuit-board-768x612.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-circuit-board-600x478.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fb4f918 elementor-widget elementor-widget-n-accordion\" data-id=\"fb4f918\" data-element_type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;all_collapsed&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2630\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2630\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> HDI PCB 1 n 1 <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2630\" class=\"elementor-element elementor-element-e881a76 e-con-full e-flex e-con e-child\" data-id=\"e881a76\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1e1c2a1 elementor-widget elementor-widget-text-editor\" data-id=\"1e1c2a1\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>This is the simplest HDI PCB design structure suitable for BGA with lower I\/O counts. It has a fine line, microvias and registration technologies capable of 0.4 mm ball pitch, excellent mounting stability and reliability, and may contain copper filled via. <\/p>\n<p>In this 1-N-1 type of stack-up, the \u20181\u2019 represents one sequential lamination on either side of the core. One sequential lamination adds two copper layers for a total of N+2 layers. This stack-up does not feature stacked vias. There is one extra lamination and no stacking of the vias. The buried via has been mechanically-drilled. There is no need to use a conductive fill for the via. It will naturally fill with the dielectric material. The second lamination adds the top and bottom layers. Then, we finish up with a final mechanical drill. The pcb manufacturer plans the right amount of prepreg between layer one and two so the resin flows into the buried via.         <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2631\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2631\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> HDI PCB 2 n 2 <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2631\" class=\"elementor-element elementor-element-81d102e e-con-full e-flex e-con e-child\" data-id=\"81d102e\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ad452a6 elementor-widget elementor-widget-text-editor\" data-id=\"ad452a6\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>2+N+2 in PCB manufacturing refers to a stack-up structure in the design of a printed circuit board. The numbers 2 and 2 represent the number of copper layers (or other materials) in the core of the board, which provides the electrical connection and stability for the components. The &#8220;N&#8221; refers to the number of additional signal layers that can be added between the core layer. The value of &#8220;N\u201d is determined by the complexity and number of electrical connections needed on the PCB.   <\/p>\n<p>For example, the term &#8220;4+n+4\u201d in the sequential lamination of printed circuit boards refers to the number of layers used in the manufacturing process of a PCB.<\/p>\n<p>The stack-up structure is crucial in determining the overall electrical performance, signal integrity, and thermal management of the PCB. By having 4 layers in the core and additional N layers in the inner portion, the designer can optimize the routing, shielding, and decoupling strategies to meet the electrical requirements of the board. The additional 4 layers in the core provide additional stability and improve the mechanical integrity of the board.  <\/p>\n<p>Overall, the 4+N+4 stack-up structure in PCB manufacturing provides a balanced design that offers the necessary electrical performance, reliability, and mechanical strength for the printed circuit board.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2632\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2632\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Anylayer pcb <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2632\" class=\"elementor-element elementor-element-a93ba3f e-con-full e-flex e-con e-child\" data-id=\"a93ba3f\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9622855 elementor-widget elementor-widget-text-editor\" data-id=\"9622855\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>These are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices. <\/p>\n<p>Any layer hdi pcb is sometimes referred to as any-layer HDI, meaning signals can be routed on high density interconnects between any layer in the stackup. These advanced HDI PCBs contain multiple layers of copper-filled stacked in-pad microvias that enable even more complex interconnections. When using any layer hdi pcb on an HDI board, each layer has its own copper-filled, laser-drilled microvias. any layer hdi pcb uses only stacked copper-filled microvias to make connections through each layer. This allows connections to be made between any two layers in the PCB once the layers are stacked. Not only does this offer an increased level of flexibility, but it also allows designers to maximize interconnect density on any layer.     <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e5bdc5b e-con-full e-flex e-con e-child\" data-id=\"e5bdc5b\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9106842 elementor-widget elementor-widget-heading\" data-id=\"9106842\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">HDI Printed Circuit Board Structure<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6d04de7 elementor-widget elementor-widget-text-editor\" data-id=\"6d04de7\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>The Institute for Printed Circuits (IPC-2226) provides six design structures for HDI printed circuit boards. These designs are defined by the IPC-2226 standard. Every structure can be represented by the notation i+[C]+i, with i indicating the number of layers on each side of the \u201ccore\u201d: which is represented as [C]. The core of a PCB is the rigid base material onto which copper traces are imprinted. Below are the three most commonly used structures in the manufacture of HDI printed circuit boards.    <\/p>\n<p>In the IPC-2226 specification, HDI features are classified into three types:<\/p>\n<ul>\n<li>Type I: Microvia features, with a size of 0.15 mm (6 mils) or less.<\/li>\n<li>Type II: Blind via features, where the via does not pass through the entire board and terminates on an internal layer. The size of Type II vias is typically between 0.15 mm and 0.50 mm (6 mils to 20 mils). <\/li>\n<li>Type III: Through-hole via features, where the via passes through the entire board and extends out through both sides. The size of Type III vias is typically greater than 0.50 mm (20 mils). <\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-9bf18aa elementor-widget elementor-widget-default\" data-id=\"9bf18aa\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Show More<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>Each type of HDI feature is designed to meet specific requirements and is used in different applications. The IPC-2226 specification provides design guidelines and performance criteria for HDI features and is widely used in the electronics industry as a reference for the design and manufacture of high-density printed circuit boards.<\/p><p>Based on the IPC-2315 standard from the Institute of Printed Circuits (IPC), fabricators may use HDI PCB stackup of types I, II, III, IV, V, or Vi. Of the above, types IV, V, and VI are more expensive to fabricate and usually not suitable for high density PCBs with challenges of routing and BGA breakout.<\/p><p>Manufacturability of HDI design primarily has to do with via structures. Microvia structures can have a big impact on the manufacturing process since they directly affect the number of lamination cycles. The more variations you have of layers where microvias start and stop at, the more number of sequential laminations are needed for the PCB manufacturing.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a0e3e06 e-flex e-con-boxed e-con e-parent\" data-id=\"a0e3e06\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-f1e0ee2 e-con-full e-flex e-con e-child\" data-id=\"f1e0ee2\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8b40dd1 elementor-widget elementor-widget-image\" data-id=\"8b40dd1\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"1024\" height=\"918\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-2.webp\" class=\"attachment-full size-full wp-image-5000\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-2.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-2-300x269.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-2-768x689.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-2-600x538.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-49ea2ee e-con-full e-flex e-con e-child\" data-id=\"49ea2ee\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-f56a987 elementor-widget elementor-widget-heading\" data-id=\"f56a987\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Any Layer HDI PCB Fabrication<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7dc56e0 elementor-widget elementor-widget-text-editor\" data-id=\"7dc56e0\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>The any layer hdi pcb manufacturing process starts with an ultra-thin core with laser-drilled microvias and a solid copper-filled base. After the initial microvia on an inner layer is filled with copper, the next dielectric layer is added in sequential lamination. Laser drilling is applied to the new layer to build the any layer hdi pcb PCB stacked, followed by filling the vias in that layer with copper. This is repeated until the desired stack is built with copper-filled microvias. The sequential copper fill improves the structural integrity of the board and is needed to prevent dimpling\/voiding in the interior microvias as long as buildup produces strong plating interfaces should stacked microvias be used.    <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-fbb9416 e-flex e-con-boxed e-con e-parent\" data-id=\"fbb9416\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-551d6d0 e-con-full e-flex e-con e-child\" data-id=\"551d6d0\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0de29b4 elementor-widget elementor-widget-image\" data-id=\"0de29b4\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"947\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-manufacturer.webp\" class=\"attachment-full size-full wp-image-4999\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-manufacturer.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-manufacturer-300x277.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-manufacturer-768x710.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-pcb-manufacturer-600x555.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a5bdc7f e-con-full e-flex e-con e-child\" data-id=\"a5bdc7f\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-006be35 elementor-widget elementor-widget-heading\" data-id=\"006be35\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Sequential Lamination Cycles<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-99bd2c7 elementor-widget elementor-widget-text-editor\" data-id=\"99bd2c7\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Sequential lamination of PCBs is a process where multiple layers of metal and insulating materials are stacked and laminated together in a sequential manner. This process is used to build <a href=\"https:\/\/hdicircuitboard.com\/multilayer-pcb\/\">multi-layer PCB<\/a>s that have more complex and dense circuit layouts. In sequential lamination, each layer is added one by one, with a dry film photoresist material being applied on top of each layer and then etched to form the desired pattern. This process is repeated for each layer, and after all the layers are assembled, the entire stack is pressed and cured under heat and pressure to form a solid and highly dense PCB.   <\/p>\n<p>Each lamination cycle or a sequential lamination process involves stacking the desired number of layers of material, followed by the application of heat and pressure to bond the layers together. The process is repeated for each cycle until the desired final thickness is achieved. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-416fc8d elementor-widget elementor-widget-n-accordion\" data-id=\"416fc8d\" data-element_type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;all_collapsed&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-6860\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-6860\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Challenges Faced in Sequential Lamination Cycles In Printed Circuit Boards <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-6860\" class=\"elementor-element elementor-element-126e153 e-con-full e-flex e-con e-child\" data-id=\"126e153\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d3858d0 elementor-widget elementor-widget-text-editor\" data-id=\"d3858d0\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<ul>\n<li>Lamination Consistency: Ensuring consistent lamination quality across multiple cycles is a major challenge, as it is difficult to control the uniformity of pressure, temperature, and time, leading to uneven lamination.<\/li>\n<li>Delamination: Delamination is a common issue that occurs when the bond between the layers of a printed circuit board weakens or fails. This can occur due to multiple lamination cycles, which increase the risk of delamination and can result in the circuit board failing. <\/li>\n<li>Warping: Warping is another common problem associated with multiple lamination cycles. Warping occurs when the printed circuit board is not evenly heated and cooled, leading to distortion of the circuit board and causing it to become warped. <\/li>\n<li>Lamination Defects: Lamination defects, such as air bubbles, cracks, and voids, can occur during the lamination process. These defects can weaken the circuit board and reduce its reliability. <\/li>\n<li>Material Compression: Multiple lamination cycles can also result in material compression, which can cause the printed circuit board to lose its original thickness. This can impact the performance and reliability of the board. <\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f3c79f6 e-flex e-con-boxed e-con e-parent\" data-id=\"f3c79f6\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8b3b7ab elementor-widget elementor-widget-heading\" data-id=\"8b3b7ab\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">HDI Circuit Board Application<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d4f2245 e-grid e-con-full e-con e-child\" data-id=\"d4f2245\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b9c1628 elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"b9c1628\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"90\" height=\"90\" viewBox=\"0 0 90 90\" fill=\"none\"><path d=\"M70.1999 15.3618C70.1999 10.0377 65.8839 5.72168 60.5598 5.72168H29.3843C24.0601 5.72168 19.7441 10.0377 19.7441 15.3618V74.5983C19.7441 79.9225 24.0601 84.2384 29.3843 84.2384H60.5598C65.8839 84.2384 70.1999 79.9225 70.1999 74.5983V15.3618ZM23.2518 20.8314H66.6923V67.3299H23.2518V20.8314ZM29.3864 9.2293H60.5577C63.9458 9.2293 66.6924 11.9759 66.6924 15.364V17.3238H23.2519V15.364C23.2518 11.9759 25.9983 9.2293 29.3864 9.2293ZM60.5577 80.7308H29.3864C25.9983 80.7308 23.2518 77.9843 23.2518 74.5962V70.7476H66.6923V74.5962C66.6923 77.9843 63.9458 80.7308 60.5577 80.7308Z\" fill=\"white\"><\/path><path d=\"M45.1026 72.9443C43.6342 72.9443 42.4395 74.1391 42.4395 75.6075C42.4395 77.076 43.6342 78.2707 45.1026 78.2707C46.5711 78.2707 47.7656 77.076 47.7656 75.6075C47.7656 74.1391 46.5711 72.9443 45.1026 72.9443Z\" fill=\"white\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<h3 class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tMoblie: <br>Smart Phone\/Tablet\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t<p class=\"elementor-icon-box-description\">\n\t\t\t\t\t\tIn line with the trend of high functionality of mobile devices, our company is applying Build up Stack-via, Staggered via, Filled via &amp; Fine Pitch to the manufacturing process for small\/high density, high quality PCB.\n\n<br>Memory Module(DIMM\/SODIMM): DeskTop PC \/ Notebook PC \/ Workstation \/ Server<br><br><br>To improve the performance of PCs that require speedy processing of large sized of data, our company provides PCBs for DIMMs and SODIMMs in various forms, and also provides Customization options for servers or workstations.\t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c1ba491 elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"c1ba491\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"90\" height=\"90\" viewBox=\"0 0 90 90\" fill=\"none\"><path d=\"M83.3994 62.6309L83.2764 62.5254C82.6787 61.9893 81.8965 61.6553 81.0439 61.6553H78.9961V21.9375C78.9961 21.0234 78.627 20.1885 78.0205 19.582C77.4141 18.9756 76.5879 18.6064 75.665 18.6064H14.335C13.4121 18.6064 12.5859 18.9844 11.9795 19.582C11.373 20.1885 11.0039 21.0146 11.0039 21.9375V61.6465H8.96484C8.05078 61.6465 7.22461 62.0244 6.61816 62.6309C6.01172 63.2373 5.64258 64.0635 5.64258 64.9863V68.0625C5.64258 68.9766 6.02051 69.8115 6.61816 70.418C7.22461 71.0244 8.05078 71.3936 8.97363 71.3936H81.0615C81.9756 71.3936 82.8105 71.0244 83.417 70.418C84.0146 69.8115 84.3926 68.9854 84.3926 68.0625V64.9863C84.375 64.0635 83.9971 63.2285 83.3994 62.6309ZM14.2383 21.9375C14.2383 21.9111 14.2471 21.8936 14.2646 21.876C14.2822 21.8584 14.3086 21.8496 14.335 21.8496H75.6738C75.7002 21.8496 75.7266 21.8584 75.7441 21.876C75.7617 21.8936 75.7705 21.9199 75.7705 21.9375V61.6465H14.2383V21.9375ZM81.1406 68.0625C81.1406 68.0889 81.1318 68.1152 81.1143 68.124C81.0967 68.1416 81.0703 68.1504 81.0527 68.1504H8.95606C8.92969 68.1504 8.91211 68.1416 8.89453 68.124C8.87695 68.1064 8.86816 68.0801 8.86816 68.0625V64.9863C8.86816 64.96 8.87695 64.9424 8.89453 64.916V64.9072C8.91211 64.8896 8.92969 64.8809 8.95606 64.8809H34.9629C35.5781 65.6895 36.5361 66.2256 37.626 66.2256H52.374C53.4639 66.2256 54.4219 65.6895 55.0371 64.8809H81.0439C81.0615 64.8809 81.0791 64.8896 81.0967 64.8896L81.1143 64.9072C81.1318 64.9248 81.1406 64.9512 81.1406 64.9775V68.0625Z\" fill=\"white\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<h3 class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tSSD: <br>DeskTop PC\/Notebook PC\/Workstation\/Server\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t<p class=\"elementor-icon-box-description\">\n\t\t\t\t\t\tWith its low power consumption and high processing speed, the SSD (solid state drive) is emerging as a prospective environment friendly storage device for the next generation. It will eventually become the standard sub storage device for PCs. Currently, our company is providing multi layered, high quality PCB.  \t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1e22ecc elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"1e22ecc\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"90\" height=\"90\" viewBox=\"0 0 90 90\" fill=\"none\"><path d=\"M75.6571 12H14.3429C12.6606 12 11.0473 12.7426 9.85778 14.0645C8.66826 15.3864 8 17.1793 8 19.0488L8 58.193C8 60.0624 8.66826 61.8553 9.85778 63.1772C11.0473 64.4991 12.6606 65.2417 14.3429 65.2417H39.7143V73.3008H32.6949C32.1341 73.3008 31.5963 73.5484 31.1998 73.989C30.8033 74.4296 30.5806 75.0273 30.5806 75.6504C30.5806 76.2736 30.8033 76.8712 31.1998 77.3118C31.5963 77.7525 32.1341 78 32.6949 78H57.284C57.8447 78 58.3825 77.7525 58.779 77.3118C59.1755 76.8712 59.3983 76.2736 59.3983 75.6504C59.3983 75.0273 59.1755 74.4296 58.779 73.989C58.3825 73.5484 57.8447 73.3008 57.284 73.3008H50.3914V65.2417H75.6571C77.3394 65.2417 78.9527 64.4991 80.1422 63.1772C81.3317 61.8553 82 60.0624 82 58.193V19.0488C82 17.1793 81.3317 15.3864 80.1422 14.0645C78.9527 12.7426 77.3394 12 75.6571 12ZM46.7337 73.3008H43.2451V65.2417H46.7337V73.3008ZM77.7714 58.193C77.7714 58.8161 77.5487 59.4137 77.1522 59.8544C76.7557 60.295 76.2179 60.5425 75.6571 60.5425H14.3429C14.0652 60.5425 13.7903 60.4818 13.5338 60.3637C13.2772 60.2456 13.0442 60.0725 12.8478 59.8544C12.6515 59.6362 12.4958 59.3772 12.3895 59.0921C12.2833 58.807 12.2286 58.5015 12.2286 58.193V19.0488C12.2286 18.7402 12.2833 18.4347 12.3895 18.1496C12.4958 17.8646 12.6515 17.6055 12.8478 17.3874C13.0442 17.1692 13.2772 16.9961 13.5338 16.878C13.7903 16.76 14.0652 16.6992 14.3429 16.6992H75.6571C75.9348 16.6992 76.2097 16.76 76.4662 16.878C76.7228 16.9961 76.9558 17.1692 77.1522 17.3874C77.3485 17.6055 77.5042 17.8646 77.6105 18.1496C77.7167 18.4347 77.7714 18.7402 77.7714 19.0488V58.193Z\" fill=\"white\"><\/path><path d=\"M55 26.8384L35 39.8384\" stroke=\"white\" stroke-width=\"3\" stroke-linecap=\"round\"><\/path><path d=\"M55 38L35 51\" stroke=\"white\" stroke-width=\"3\" stroke-linecap=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<h3 class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tDisplay(LCD\/OLED): <br>OLED TV \/ PCMointor \/ NoteBook Monitor \/ Mobile, Tablet Display\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/h3>\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t<p class=\"elementor-icon-box-description\">\n\t\t\t\t\t\tDisplay is expected to continue to grow along with the rapid development of the information and communication industry. Recently, high resolution, high integration, thin thickness and light weight are required. In addition, Our Company is providing Build up Stack via, Staggered via, Filled via and fine pitches are according to customer needs to provide high-density, high-quality PCB applicable to various display products.  \t\t\t\t\t<\/p>\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-580cdc7 e-flex e-con-boxed e-con e-parent\" data-id=\"580cdc7\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-c49a69d e-con-full e-flex e-con e-child\" data-id=\"c49a69d\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1eddeb0 elementor-widget elementor-widget-heading\" data-id=\"1eddeb0\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Get started with HDI PCB<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-af3180b e-con-full e-flex e-con e-child\" data-id=\"af3180b\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-2e4fea1 e-con-full e-flex e-con e-child\" data-id=\"2e4fea1\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-91e4047 elementor-align-left elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"91e4047\" data-element_type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Blind vias, buried vias, Ultra HDI PCB<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">High frequency low loss PCB material<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Low loss high speed PCB materials<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-2c91dea e-con-full e-flex e-con e-child\" data-id=\"2c91dea\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-66b1ccf elementor-align-left elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"66b1ccf\" data-element_type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5f0ae93 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"5f0ae93\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/en-ca\/get-a-quote\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">GET A QUOTE<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>HDI PCB: Any layer hdi pcb, Ultra hdi pcb High frequency low loss PCB material Low loss high speed PCB materials R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material High-Density Interconnect, or [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-4991","page","type-page","status-publish","hentry"],"blocksy_meta":{"has_hero_section":"disabled","vertical_spacing_source":"custom","content_area_spacing":"none","styles_descriptor":{"styles":{"desktop":"","tablet":"","mobile":""},"google_fonts":[],"version":6}},"_links":{"self":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages\/4991","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/comments?post=4991"}],"version-history":[{"count":4,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages\/4991\/revisions"}],"predecessor-version":[{"id":6079,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages\/4991\/revisions\/6079"}],"wp:attachment":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/media?parent=4991"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}