{"id":5066,"date":"2024-12-30T04:15:34","date_gmt":"2024-12-29T20:15:34","guid":{"rendered":"https:\/\/hdicircuitboard.com\/microvias-pcb\/"},"modified":"2025-04-28T20:42:35","modified_gmt":"2025-04-28T12:42:35","slug":"microvias-pcb","status":"publish","type":"page","link":"https:\/\/hdicircuitboard.com\/en-ca\/microvias-pcb\/","title":{"rendered":"Microvias PCB"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"5066\" class=\"elementor elementor-5066 elementor-49\" data-elementor-settings=\"{&quot;ha_cmc_init_switcher&quot;:&quot;no&quot;}\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9f1b2b1 e-flex e-con-boxed e-con e-parent\" data-id=\"9f1b2b1\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-333af63 elementor-widget elementor-widget-heading\" data-id=\"333af63\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<div class=\"elementor-heading-title elementor-size-default\">Microvia<\/div>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-33bfdbe elementor-widget elementor-widget-text-editor\" data-id=\"33bfdbe\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<ul>\n<li>Blind vias, buried vias, Ultra HDI PCB<\/li>\n<li>High frequency low loss PCB material<\/li>\n<li>Low loss high speed PCB materials<\/li>\n<li>R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material<\/li>\n<li>EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material<\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c43178f e-flex e-con-boxed e-con e-parent\" data-id=\"c43178f\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-322bf33 e-con-full e-flex e-con e-child\" data-id=\"322bf33\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-2cf4a9b elementor-widget elementor-widget-image\" data-id=\"2cf4a9b\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"657\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia.webp\" class=\"attachment-full size-full wp-image-5072\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia-300x192.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia-768x493.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia-600x385.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-709d64d e-con-full e-flex e-con e-child\" data-id=\"709d64d\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-332528f elementor-widget elementor-widget-heading\" data-id=\"332528f\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">Microvias PCB<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a1ef77f elementor-widget elementor-widget-text-editor\" data-id=\"a1ef77f\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"https:\/\/hdicircuitboard.com\/en-ca\/hdi\/\">Microvia<\/a>s are tiny holes that traverse one or more layers of a PCB, typically with diameters ranging from 0.1mm to 0.15mm. These microscopic wonders act as pathways for signals or power connections between different layers of the board, enabling high-density interconnections. <\/p>\n<p>These small structures let traces reach inner layers of a PCB with high interconnect density and high layer count. These structures have been around for years, but they are becoming more common in a variety of systems that require multiple functions on a single circuit board. If you&#8217;ve done a size study and you&#8217;ve determined you&#8217;ll need 6 mil or smaller traces to fit all your components in your printed circuit board, your design is likely dense enough that microvias are needed to support routing between layers.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-69ff9d7 elementor-widget elementor-widget-default\" data-id=\"69ff9d7\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Show More<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>microvia is just a very small version of a typical via, but the structure is a bit different. Microvias have conical frustum shape; the via slopes inwards as it makes a layer transition and terminates at a pad in the next layer. Ideally, microvias will only span a single layer for maximum reliability. Designers can use stacked microvias to form connections across multiple layers, where blind and buried microvias are built up into a stack to reach across multiple layers.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ad59320 e-flex e-con-boxed e-con e-parent\" data-id=\"ad59320\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-d6776d6 e-con-full e-flex e-con e-child\" data-id=\"d6776d6\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-90c5e58 elementor-widget elementor-widget-heading\" data-id=\"90c5e58\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Microvias PCB Via Structures<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-494fda3 e-con-full e-flex e-con e-child\" data-id=\"494fda3\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4167350 elementor-widget elementor-widget-text-editor\" data-id=\"4167350\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"https:\/\/hdicircuitboard.com\/en-ca\/\">High density interconnect<\/a>s are categorized by six design types in IPC-2226. They are grouped by stackup characteristics in the following categories: Type I, Type II, Type III, Type IV, Type V, and Type VI <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5ef0f58 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"5ef0f58\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/en-ca\/get-a-quote\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">GET A QUOTE<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5258fbc e-con-full e-grid e-con e-child\" data-id=\"5258fbc\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-e05a206 e-con-full e-flex e-con e-child\" data-id=\"e05a206\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-70a1a39 elementor-widget elementor-widget-heading\" data-id=\"70a1a39\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE I<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fe7f31d elementor-widget elementor-widget-text-editor\" data-id=\"fe7f31d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>1 [C] 0 or 1 [C] 1, with through-vias from surface to surface.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b044b1e e-con-full e-flex e-con e-child\" data-id=\"b044b1e\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ee3c339 elementor-widget elementor-widget-heading\" data-id=\"ee3c339\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE II<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3d339ec elementor-widget elementor-widget-text-editor\" data-id=\"3d339ec\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>1 [C] 0 or 1 [C] 1, with buried vias in the core and may have through-vias connecting the outer layers from surface to surface.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d906f85 e-con-full e-flex e-con e-child\" data-id=\"d906f85\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e90565e elementor-widget elementor-widget-heading\" data-id=\"e90565e\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE III<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8e9e8b7 elementor-widget elementor-widget-text-editor\" data-id=\"8e9e8b7\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>2 [C] 0, two or more HDI layers added to through-vias in the core or from surface to surface.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-270f411 e-con-full e-flex e-con e-child\" data-id=\"270f411\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b6ff8ee elementor-widget elementor-widget-heading\" data-id=\"b6ff8ee\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE IV<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3767514 elementor-widget elementor-widget-text-editor\" data-id=\"3767514\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>1[P] 0 where P is a passive substrate with no electrical connecting functions.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9491e5f e-con-full e-flex e-con e-child\" data-id=\"9491e5f\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a81c9a4 elementor-widget elementor-widget-heading\" data-id=\"a81c9a4\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE V<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4cb694e elementor-widget elementor-widget-text-editor\" data-id=\"4cb694e\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Coreless constructions using layer pairs.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0381bc1 e-con-full e-flex e-con e-child\" data-id=\"0381bc1\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-cebd87f elementor-widget elementor-widget-heading\" data-id=\"cebd87f\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE VI<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7675797 elementor-widget elementor-widget-text-editor\" data-id=\"7675797\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Alternate constructions of coreless construction using layer pairs.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-78d89d1 e-flex e-con-boxed e-con e-parent\" data-id=\"78d89d1\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-28f0499 e-con-full e-flex e-con e-child\" data-id=\"28f0499\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-f3133f4 elementor-widget elementor-widget-image\" data-id=\"f3133f4\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"200\" height=\"200\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/icon-hdi-microvia-fabrication.svg\" class=\"attachment-full size-full wp-image-5067\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-930f6e9 elementor-widget elementor-widget-n-accordion\" data-id=\"930f6e9\" data-element_type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;all_collapsed&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1540\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1540\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Blind Microvias <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1540\" class=\"elementor-element elementor-element-f281c52 e-con-full e-flex e-con e-child\" data-id=\"f281c52\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-dd0b217 elementor-widget elementor-widget-text-editor\" data-id=\"dd0b217\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Blind microvias start in the surface layer and terminate 1 layer below the surface, although they could terminate or 2 layers below the surface layer if the aspect ratio is kept low. If you need to span 2 layers, it&#8217;s better to use stacked microvias (see below) or staggered microvias as these will be more reliable. Blind microvias could be filled or unfilled.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1541\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1541\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Buried Microvias <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1541\" class=\"elementor-element elementor-element-594aa2e e-con-full e-flex e-con e-child\" data-id=\"594aa2e\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8677960 elementor-widget elementor-widget-text-editor\" data-id=\"8677960\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Buried microvias have basically the same structure as blind vias and span between two interior layers and do not reach either circuit board surface. Just like blind microvias, it&#8217;s best the aspect ratio stays low and they span a single layer to ensure reliability and ease of fabrication. These vias are filled with copper, either using a plating process with pure copper or with a epoxy + copper resin to ensure a strong connection across the head of the microvia. It&#8217;s important that the process being used for plating results in void-free structures to ensure maximum reliability.   <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1542\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1542\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Stacked or staggered vias <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1542\" class=\"elementor-element elementor-element-bd72bac e-con-full e-flex e-con e-child\" data-id=\"bd72bac\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9d328b4 elementor-widget elementor-widget-text-editor\" data-id=\"9d328b4\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Stacked microvias create more space for the high-density wiring and fanout from low-pitch BGAs but it increases the PCB cost. Stacked microvias should only be used when the design doesn\u00b4t have sufficient space to use staggered vias. Microvias stacked on buried vias require additional Cu cap plating process for the buried vias and microvias stacked on microvias require additional Cu filling of the inner layer microvias.  <\/p>\n<p>As the layer-by-layer process for forming low aspect ratio microvias makes them useful in stacked applications. Stacked microvias are simply stacks of buried vias, or a blind microvia stacked on top of buried microvias. This is the standard way to span between multiple layers in an HDI PCB. The internal buried microvias in the stack need to be filled with conductive paste and plated over to ensure strong contact as the next via in the stack is deposited and plated. The alternative to stacked microvias is staggered microvias, where microvias on successive layers are offset from each other.    <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7f4708b e-con-full e-flex e-con e-child\" data-id=\"7f4708b\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-637d750 elementor-widget elementor-widget-heading\" data-id=\"637d750\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">HDI Microvia Fabrication<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-dda11d8 elementor-widget elementor-widget-text-editor\" data-id=\"dda11d8\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Depending on the size of the vias, they can be mechanically drilled and plated (followed by stacking and pressing each layer), or they can be formed with a high-power laser. The latter process is constantly being improved and is preferred in high volume PCB manufacturing thanks to its high throughput. New advances in laser drilling techniques are pushing microvia sizes down to as small as 15 \u00b5m.  <\/p>\n<p>After drilling and cleaning, the via hole is plated, either with a sputtering process, electrolytic deposition, or electroless copper plating process. The goal in the plating process is to prevent the formation of voids, dimples, bumps, or any other structural defect in the filled via. Voids are also a reliability concern as stress can concentrate around the edge of the void where copper is thinner if stress is applied to the via structure.  <\/p>\n<p>During fabrication, laser-drilled microvias have a lower potential for manufacturing defects than normal vias. Mechanically-drilled microvias can have defects due to drill vibration as the drill wears out, and mechanical microvia drilling is only useful down to 6 to 8 mil diameters, depending on the fabricator&#8217;s tooling . <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-eccaebb e-flex e-con-boxed e-con e-parent\" data-id=\"eccaebb\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-61e1003 e-con-full e-flex e-con e-child\" data-id=\"61e1003\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-be412c6 elementor-widget elementor-widget-heading\" data-id=\"be412c6\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Filled or Unfilled Microvias<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d5b1901 elementor-widget elementor-widget-text-editor\" data-id=\"d5b1901\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>It is possible to either fill microvias with copper or leave them unfilled. For buried microvias, it is necessary to fill the via hole with copper, especially if they are to be stacked. Any voids present in the interior of the via barrel can lead to premature fracture during reflow. Although it is possible to leave blind microvias unfilled, in-pad blind microvias must always be filled.   <\/p>\n<p>Following the filling, the manufacturer will plate the microvia. They typically use epoxy and copper resin or pure copper for the process. Beginning with a conformal coating, the manufacturer typically uses pulse plating to fill in the body of the microvia with solid copper, thereby eliminating voids. Additives in the filler material are necessary during the plating process, as their absence may result in void formation. Another reason for using additives is to prevent the copper from being concentrated on the walls and the top surface of the microvia. Uneven deposition of copper along the via body may also be conformal plating, and this may lead to the formation of voids.     <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-226e469 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"226e469\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/en-ca\/get-a-quote\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">GET A QUOTE<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-cbe5fde e-flex e-con-boxed e-con e-parent\" data-id=\"cbe5fde\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-cfc23de e-con-full e-flex e-con e-child\" data-id=\"cfc23de\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a0be8b4 elementor-widget elementor-widget-heading\" data-id=\"a0be8b4\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Via Filling Options<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-dfcc0e9 e-con-full e-flex e-con e-child\" data-id=\"dfcc0e9\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c840274 elementor-widget elementor-widget-text-editor\" data-id=\"c840274\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>As a refresher, a via is a copper plated hole that is used to connect two or more layers within a PCB together. Via Fill is a special PCB manufacturing technique used to selectively and completely close via holes with epoxy. There are many instances in which a PCB designer might want to have a via filled. Some key benefits are:   <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7e96be5 e-grid e-con-full e-con e-child\" data-id=\"7e96be5\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-622837b e-con-full e-flex e-con e-child\" data-id=\"622837b\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-84970e4 elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"84970e4\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"80\" height=\"80\" viewBox=\"0 0 80 80\" fill=\"none\"><path d=\"M10 13.7594L40.0143 5L70 13.7594V31.7228C70 50.6037 57.917 67.3657 40.0043 73.3342C22.0868 67.3658 10 50.6 10 31.7145V13.7594Z\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linejoin=\"round\"><\/path><path d=\"M39.916 24.9155V51.5822\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M26.582 38.2485H53.2487\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tMore reliable surface mounts\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/div>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f80703e e-con-full e-flex e-con e-child\" data-id=\"f80703e\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-86312ae elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"86312ae\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"80\" height=\"80\" viewBox=\"0 0 80 80\" fill=\"none\"><path d=\"M65 10H15C12.2386 10 10 12.2386 10 15V65C10 67.7615 12.2386 70 15 70H65C67.7615 70 70 67.7615 70 65V15C70 12.2386 67.7615 10 65 10Z\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linejoin=\"round\"><\/path><path d=\"M22.4023 49.7243L31.8305 40.2962L39.1438 47.5923L56.6693 30\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M43.334 30H56.6673V43.3333\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tIncreased assembly yields\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/div>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-977a682 e-con-full e-flex e-con e-child\" data-id=\"977a682\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c3314ae 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66.0298 24.4528 66.7986 25.1919 67.5376C27.1149 69.4606 34.8069 75.2296 42.4989 74.2681C50.1908 73.3066 56.9213 67.5376 59.8058 60.8071C62.6903 54.0766 60.7673 46.3846 55.9598 40.6156C51.1523 34.8468 42.4989 33.8853 40.5759 33.8853C38.6529 33.8853 31.9224 33.8853 25.1919 41.5771Z\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M52.6044 37.7304L21.0728 13.6179C20.4091 13.1105 19.4608 13.1662 18.9659 13.8392C17.7778 15.4554 16.6554 18.0177 18.4598 20.4236C20.7673 23.5002 29.6771 31.3204 33.8434 34.8459\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M58.3317 43.3338L38.5664 6.99762C38.1675 6.26421 37.2794 5.92844 36.5532 6.3406C34.8087 7.3309 32.7375 9.21225 33.4029 12.1454C34.2537 15.8961 37.6337 22.5813 39.9984 27.5004\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M60 46.6664L58.4172 12.8201C58.3782 11.9867 57.7263 11.2973 56.8937 11.3505C54.8917 11.4785 52.2053 12.265 51.5217 15.1945C50.6475 18.9399 50.0232 24.5419 50 29.9998\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tImproved reliability by decreasing the probability of trapped air or liquids.\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/div>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-292df47 e-flex e-con-boxed e-con e-parent\" data-id=\"292df47\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-eac71c9 e-con-full e-flex e-con e-child\" data-id=\"eac71c9\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-40c9821 elementor-widget elementor-widget-image\" data-id=\"40c9821\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"1024\" height=\"814\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia.webp\" class=\"attachment-large size-large wp-image-5073\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia-300x238.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia-768x611.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia-600x477.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f6f7ef8 e-con-full e-flex e-con e-child\" data-id=\"f6f7ef8\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b262bf3 elementor-widget elementor-widget-heading\" data-id=\"b262bf3\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Via In Pad<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ed39bd5 elementor-widget elementor-widget-text-editor\" data-id=\"ed39bd5\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Perhaps one of the greatest benefits of via fill is the option to implement via in pad.This process is becoming more and more popular and preferred as opposed to using the traditional \u201cdog bone\u201d method to transfer signal from the BGA, through the via, and on to inner layers. In this process, also known as active pad, vias are filled, planarized, plated over with copper. While the Via-In-Pad process does increase cost there can be significant benefits over conventional through hole technology.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-2794a51 elementor-widget elementor-widget-default\" data-id=\"2794a51\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Show More<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>Some key benefits are:<\/p><ul><li>Tighter BGA pitches<\/li><li>Increased thermal dissipation<\/li><li>Reduced layer count or board size, which ultimately may reduce cost<\/li><li>Improved routing density (higher density per layer)<\/li><li>Strengthening Pad attachment<\/li><li>Gives high frequency designs the shortest possible route to bypass capacitors<\/li><li>Overcomes high speed desogn issues and constraints such as low inductance<\/li><\/ul><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c33de13 elementor-widget elementor-widget-n-accordion\" data-id=\"c33de13\" data-element_type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;all_collapsed&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2040\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2040\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Conductive Via Filling <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2040\" class=\"elementor-element elementor-element-199e226 e-con-full e-flex e-con e-child\" data-id=\"199e226\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0b034fa elementor-widget elementor-widget-text-editor\" data-id=\"0b034fa\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Conductive via filling allows the effective transfer of electrical signals from one side of the circuit board to the other, while enhancing its thermal transfer properties of the via. Conductive filled vias (copper or silver are the most common) are especially helpful for conducting a large amount of heat away from components as the metallic nature of the fill wicks heat away from the IC. <\/p>\n<p>Silver epoxy is more cost-effective and used more frequently but copper conductive epoxy is far better in terms of thermal conductivity. However, both will improve the quality of current conduction between the vias and the PCBs internal layers. It should be noted that conductive fill of vias is approximately 5x the cost of non-conductive fill.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2041\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2041\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Non-Conductive Via Filling <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2041\" class=\"elementor-element elementor-element-2378295 e-con-full e-flex e-con e-child\" data-id=\"2378295\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5f964f7 elementor-widget elementor-widget-text-editor\" data-id=\"5f964f7\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Non-conductive via fill is done using the same process as conductive except that it is usually done to prevent solder or other contaminants from entering the via rather than conducting heat and a signal. It also provides structural support for a copper pad covering the hole in the case of a via-in-pad. Keep in mind that the vias are still plated with copper so they will conduct heat and electrical signals, as the only difference between traditional vias is the air in the space is replaced by the fill material.  <\/p>\n<p>It is always recommended to match the CTE values of the via filling to be used with the surrounding laminate to avoid future stress fractures due to contraction or expansion. Because the via fill material will heat up and expand far more rapidly than the laminate, this unequal expansion can cause a fracture to appear between the pad and the hole wall. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2042\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2042\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Copper-Plated Shut Filled Vias <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2042\" class=\"elementor-element elementor-element-3528ef0 e-con-full e-flex e-con e-child\" data-id=\"3528ef0\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4a71c26 elementor-widget elementor-widget-text-editor\" data-id=\"4a71c26\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Most PCB designers have experience with the use of filled vias using epoxy, but many are not familiar with the process of copper plated shut for either through vias and\/or microvias, as not all PCB fabricators have invested in the proper equipment to perform this process.<\/p>\n<p>Benchuang Electronics has developed a process that allows us to plate shut through-hole vias, up to 12 mils in diameter, without concern of voids, air pockets, or fluid entrapment in the holes. Without question, plated shut vias provide 10X the thermal conductivity of any other via fill solution, which makes it the most logical choice for thermal dissipation. <\/p>\n<p>Generally speaking, when the aspect ratio gets to 10:1 or via diameter is less than 8 mils, that is where we would opt to copper plate shut a via, but there are other specific attributes where it is very difficult to fill, or plate shut vias:<\/p>\n<ul>\n<li>Thin materials or subs (less than 20 mils) are more difficult to process through planarization as the material can tear and\/or distort.<\/li>\n<li>If wrap plating is required, so terminating surfaces have a buildup of copper, making fine lines\/spaces more difficult to process.<\/li>\n<li>PTFE\/Teflon materials will dramatically distort.<\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-63f130c e-flex e-con-boxed e-con e-parent\" data-id=\"63f130c\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-a0f8e63 e-con-full e-flex e-con e-child\" data-id=\"a0f8e63\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-99ae510 elementor-widget elementor-widget-image\" data-id=\"99ae510\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"814\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb.webp\" class=\"attachment-large size-large wp-image-5075\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb-300x238.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb-768x611.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb-600x477.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-92044ae e-con-full e-flex e-con e-child\" data-id=\"92044ae\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-45c07a6 elementor-widget elementor-widget-heading\" data-id=\"45c07a6\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Staggered Microvias<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-61684b6 elementor-widget elementor-widget-text-editor\" data-id=\"61684b6\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Like stacked vias, staggered vias also connect different layers of the board. However, they are never in direct contact with each other as their drill axes are separate, which offsets their position on adjacent layers. <\/p>\n<p>Staggering the microvias involves fewer design steps. Because the drilled hole is not directly above the one below it, laser-drilled staggered vias do not need copper filling. This makes the design less complicated.  <\/p>\n<p>While designing a staggered via structure, the spacing between the laser-drilled holes is the primary concern. The possibility of the staggered via design depends on the vertical distance between the centers of two adjacent microvias. A viable staggered design requires the vertical separation to be more than the diameter of the microvia.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f2ed4e0 elementor-widget elementor-widget-default\" data-id=\"f2ed4e0\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Show More<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>Stacking microvias exerts pressure on the via walls. The pressure can detach the topmost via from its pad. Therefore, designers prefer a staggered microvia configuration when they have to interconnect more than two layers.<\/p><p>However, if the design has space constraints, staggered vias may not be the right choice. Although less complex, staggering makes them use up more space on the board. On the other hand, staggering has negligible crosstalk issues because of the offset. Staggering introduces more discontinuity in the signal path. This makes it difficult to maintain a uniform via impedance requirement in a high-speed design.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c35dc0b e-flex e-con-boxed e-con e-parent\" data-id=\"c35dc0b\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-8943803 e-con-full e-flex e-con e-child\" data-id=\"8943803\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a2c518a elementor-widget elementor-widget-image\" data-id=\"a2c518a\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"814\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb.webp\" class=\"attachment-large size-large wp-image-5074\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb-300x238.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb-768x611.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb-600x477.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-207a98d e-con-full e-flex e-con e-child\" data-id=\"207a98d\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0a75114 elementor-widget elementor-widget-heading\" data-id=\"0a75114\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Stacked Microvias<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b1acbb3 elementor-widget elementor-widget-text-editor\" data-id=\"b1acbb3\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Stacked vias have the vias placed directly one atop the other. The operator drills each via and plates it before stacking it above another to connect various layers. They use two narrow annular rings, one on the top and the other, on the bottom. The upper annular ring helps in precise registration, while the bottom one makes the electrical connection.   <\/p>\n<p>The operator fills the stacked vias with electroplated copper. This not only provides structured support but also ensures a solid electrical connection. However, improper deposition can create defects like voids and inferior bonding between the base of the via and the target pad beneath it, hampering the reliability of the stacked vias.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b2ffb61 elementor-widget elementor-widget-default\" data-id=\"b2ffb61\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Show More<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>While compactness is the primary advantage of stacked vias, in HDI boards stacked vias also ensure flexibility during practical routing. In addition, stacked vias help maintain properly controlled impedance of the signal from its source to its destination.<\/p><p>Exerting pressure from the z-axis of the dielectric on the microvia actually impacts the reliability. The reason for this is a mismatch in the CTE of the materials. For instance, consider the situation beyond the glass transition temperature. While copper expands only up to 16 parts per million, the dielectric expands nearly 200 parts per million.<\/p><p>As long as only a single layer is present, there is not much of an issue. The discrepancy really begins when the layer number increases to two and beyond. For instance, with a layer count of three or more, the mismatch crosses tolerance limits. It can lead to microvia failure due to its barrel or its corner cracking up. This led to designers staggering the vias rather than stacking them vertically.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-3cd58ab e-flex e-con-boxed e-con e-parent\" data-id=\"3cd58ab\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-0aeee15 e-con-full e-flex e-con e-child\" data-id=\"0aeee15\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-41b47ee elementor-widget elementor-widget-heading\" data-id=\"41b47ee\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Get started with Microvia PCB<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-dffad92 e-con-full e-flex e-con e-child\" data-id=\"dffad92\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-2870bae e-con-full e-flex e-con e-child\" data-id=\"2870bae\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ea3c115 elementor-align-left elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"ea3c115\" data-element_type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Blind vias, buried vias, Ultra HDI PCB<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">High frequency low loss PCB material<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Low loss high speed PCB materials<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f709ba6 e-con-full e-flex e-con e-child\" data-id=\"f709ba6\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d640799 elementor-align-left elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"d640799\" data-element_type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cb656bd elementor-align-center elementor-widget elementor-widget-button\" data-id=\"cb656bd\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/en-ca\/get-a-quote\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">GET A QUOTE<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Microvia Blind vias, buried vias, Ultra HDI PCB High frequency low loss PCB material Low loss high speed PCB materials R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material Microvias PCB Microvias are [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-5066","page","type-page","status-publish","hentry"],"blocksy_meta":{"has_hero_section":"disabled","vertical_spacing_source":"custom","content_area_spacing":"none","styles_descriptor":{"styles":{"desktop":"","tablet":"","mobile":""},"google_fonts":[],"version":6}},"_links":{"self":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages\/5066","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/comments?post=5066"}],"version-history":[{"count":4,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages\/5066\/revisions"}],"predecessor-version":[{"id":6094,"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/pages\/5066\/revisions\/6094"}],"wp:attachment":[{"href":"https:\/\/hdicircuitboard.com\/en-ca\/wp-json\/wp\/v2\/media?parent=5066"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}