{"id":6674,"date":"2024-12-30T04:15:34","date_gmt":"2024-12-29T20:15:34","guid":{"rendered":"https:\/\/hdicircuitboard.com\/circuit-imprime-microvia\/"},"modified":"2025-12-05T16:45:25","modified_gmt":"2025-12-05T08:45:25","slug":"circuit-imprime-microvia","status":"publish","type":"page","link":"https:\/\/hdicircuitboard.com\/fr\/circuit-imprime-microvia\/","title":{"rendered":"Circuit Imprim\u00e9 Microvia"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"6674\" class=\"elementor elementor-6674 elementor-49\" data-elementor-settings=\"{&quot;ha_cmc_init_switcher&quot;:&quot;no&quot;}\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9f1b2b1 e-flex e-con-boxed e-con e-parent\" data-id=\"9f1b2b1\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-333af63 elementor-widget elementor-widget-heading\" data-id=\"333af63\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<div class=\"elementor-heading-title elementor-size-default\">Microvia<\/div>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-33bfdbe elementor-widget elementor-widget-text-editor\" data-id=\"33bfdbe\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<ul>\n<li>Vias aveugles, vias enterr\u00e9s, Circuits Imprim\u00e9s Ultra HDI<\/li>\n<li>Mat\u00e9riaux de circuits imprim\u00e9s hyperfr\u00e9quence \u00e0 faible perte<\/li>\n<li>Mat\u00e9riaux de circuits imprim\u00e9s haute vitesse \u00e0 faible perte<\/li>\n<li>R-5775, R-5785, R-5795, TU-872 SLK, TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, mat\u00e9riau Tachyon 100G<\/li>\n<li>EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE<\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c43178f e-flex e-con-boxed e-con e-parent\" data-id=\"c43178f\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-322bf33 e-con-full e-flex e-con e-child\" data-id=\"322bf33\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-2cf4a9b elementor-widget elementor-widget-image\" data-id=\"2cf4a9b\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"657\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia.webp\" class=\"attachment-full size-full wp-image-6680\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia-300x192.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia-768x493.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/Microvia-600x385.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-709d64d e-con-full e-flex e-con e-child\" data-id=\"709d64d\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-332528f elementor-widget elementor-widget-heading\" data-id=\"332528f\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">Circuit Imprim\u00e9 Microvia<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a1ef77f elementor-widget elementor-widget-text-editor\" data-id=\"a1ef77f\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"https:\/\/hdicircuitboard.com\/fr\/circuit-imprime-hdi\/\">Les microvias<\/a> sont des trous minuscules traversant une ou plusieurs couches d&rsquo;un Circuit Imprim\u00e9, avec des diam\u00e8tres g\u00e9n\u00e9ralement compris entre 0,1 mm et 0,15 mm. Ces structures microscopiques servent de chemins pour les signaux ou les connexions d&rsquo;alimentation entre diff\u00e9rentes couches de la carte, permettant ainsi des interconnexions haute densit\u00e9. <\/p>\n<p>Ces petites structures permettent aux pistes d&rsquo;atteindre les couches internes d&rsquo;un Circuit Imprim\u00e9 avec une densit\u00e9 d&rsquo;interconnexion \u00e9lev\u00e9e et un nombre important de couches. Bien que ces structures existent depuis des ann\u00e9es, elles deviennent de plus en plus courantes dans divers syst\u00e8mes n\u00e9cessitant plusieurs fonctions sur une seule carte \u00e9lectronique. Si une \u00e9tude dimensionnelle a d\u00e9termin\u00e9 que des pistes de 6 mil (0,15 mm) ou moins sont n\u00e9cessaires pour int\u00e9grer tous les composants sur le Circuit Imprim\u00e9, la conception est suffisamment dense pour justifier l&rsquo;utilisation de microvias afin d&rsquo;assurer le routage entre les couches.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-69ff9d7 elementor-widget elementor-widget-default\" data-id=\"69ff9d7\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Afficher plus<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\">Un microvia est simplement une version extr\u00eamement r\u00e9duite d'un via classique, mais sa structure diff\u00e8re l\u00e9g\u00e8rement. Les microvias ont une forme de tronc de c\u00f4ne ; le via s'incline vers l'int\u00e9rieur lors de la transition entre couches et se termine sur un plot dans la couche suivante. Id\u00e9alement, les microvias ne devraient traverser qu'une seule couche pour garantir une fiabilit\u00e9 maximale. Les concepteurs peuvent utiliser des microvias empil\u00e9s pour \u00e9tablir des connexions sur plusieurs couches, o\u00f9 des microvias aveugles et enterr\u00e9s sont superpos\u00e9s pour traverser plusieurs niveaux.<\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ad59320 e-flex e-con-boxed e-con e-parent\" data-id=\"ad59320\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-d6776d6 e-con-full e-flex e-con e-child\" data-id=\"d6776d6\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-90c5e58 elementor-widget elementor-widget-heading\" data-id=\"90c5e58\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Structures de vias des Circuits Imprim\u00e9s Microvia<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-494fda3 e-con-full e-flex e-con e-child\" data-id=\"494fda3\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4167350 elementor-widget elementor-widget-text-editor\" data-id=\"4167350\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p><a href=\"https:\/\/hdicircuitboard.com\/fr\/\">Les interconnexions haute densit\u00e9<\/a> sont class\u00e9es en six types de conception selon la norme IPC-2226. Elles sont regroup\u00e9es par caract\u00e9ristiques d&#8217;empilement dans les cat\u00e9gories suivantes : Type I, Type II, Type III, Type IV, Type V et Type VI. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-5ef0f58 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"5ef0f58\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/fr\/demander-un-devis\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Demander un devis<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5258fbc e-con-full e-grid e-con e-child\" data-id=\"5258fbc\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-e05a206 e-con-full e-flex e-con e-child\" data-id=\"e05a206\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-70a1a39 elementor-widget elementor-widget-heading\" data-id=\"70a1a39\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE I<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fe7f31d elementor-widget elementor-widget-text-editor\" data-id=\"fe7f31d\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>1 [C] 0 ou 1 [C] 1, avec des vias traversants de surface \u00e0 surface.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b044b1e e-con-full e-flex e-con e-child\" data-id=\"b044b1e\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ee3c339 elementor-widget elementor-widget-heading\" data-id=\"ee3c339\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE II<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3d339ec elementor-widget elementor-widget-text-editor\" data-id=\"3d339ec\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>1 [C] 0 ou 1 [C] 1, avec des vias enterr\u00e9s dans le noyau et pouvant comporter des vias traversants reliant les couches externes de surface \u00e0 surface.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d906f85 e-con-full e-flex e-con e-child\" data-id=\"d906f85\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e90565e elementor-widget elementor-widget-heading\" data-id=\"e90565e\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE III<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8e9e8b7 elementor-widget elementor-widget-text-editor\" data-id=\"8e9e8b7\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>2 [C] 0, deux couches HDI ou plus ajout\u00e9es aux vias traversants dans le noyau ou de surface \u00e0 surface.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-270f411 e-con-full e-flex e-con e-child\" data-id=\"270f411\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b6ff8ee elementor-widget elementor-widget-heading\" data-id=\"b6ff8ee\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE IV<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3767514 elementor-widget elementor-widget-text-editor\" data-id=\"3767514\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>1 [P] 0, o\u00f9 P est un substrat passif sans fonction de connexion \u00e9lectrique.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9491e5f e-con-full e-flex e-con e-child\" data-id=\"9491e5f\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a81c9a4 elementor-widget elementor-widget-heading\" data-id=\"a81c9a4\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE V<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4cb694e elementor-widget elementor-widget-text-editor\" data-id=\"4cb694e\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Structures sans noyau utilisant des paires de couches.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0381bc1 e-con-full e-flex e-con e-child\" data-id=\"0381bc1\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-cebd87f elementor-widget elementor-widget-heading\" data-id=\"cebd87f\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h5 class=\"elementor-heading-title elementor-size-default\">TYPE VI<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7675797 elementor-widget elementor-widget-text-editor\" data-id=\"7675797\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Constructions alternatives sans noyau utilisant des paires de couches.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-78d89d1 e-flex e-con-boxed e-con e-parent\" data-id=\"78d89d1\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-28f0499 e-con-full e-flex e-con e-child\" data-id=\"28f0499\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-f3133f4 elementor-widget elementor-widget-image\" data-id=\"f3133f4\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"200\" height=\"200\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/icon-hdi-microvia-fabrication.svg\" class=\"attachment-full size-full wp-image-6675\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-930f6e9 elementor-widget elementor-widget-n-accordion\" data-id=\"930f6e9\" data-element_type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;all_collapsed&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1540\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1540\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Microvias aveugles <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1540\" class=\"elementor-element elementor-element-f281c52 e-con-full e-flex e-con e-child\" data-id=\"f281c52\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-dd0b217 elementor-widget elementor-widget-text-editor\" data-id=\"dd0b217\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Les microvias aveugles commencent dans la couche de surface et se terminent 1 couche en dessous, bien qu&rsquo;ils puissent \u00e9galement s&rsquo;\u00e9tendre jusqu&rsquo;\u00e0 2 couches sous la surface si le rapport d&rsquo;aspect reste faible. Si une connexion sur 2 couches est n\u00e9cessaire, il est pr\u00e9f\u00e9rable d&rsquo;utiliser des microvias empil\u00e9s (voir ci-dessous) ou des microvias d\u00e9cal\u00e9s, car ces solutions offrent une meilleure fiabilit\u00e9. Les microvias aveugles peuvent \u00eatre remplis ou non remplis.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1541\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1541\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Microvias enterr\u00e9s <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1541\" class=\"elementor-element elementor-element-594aa2e e-con-full e-flex e-con e-child\" data-id=\"594aa2e\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8677960 elementor-widget elementor-widget-text-editor\" data-id=\"8677960\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Les microvias enterr\u00e9s ont fondamentalement la m\u00eame structure que les microvias aveugles, mais ils relient deux couches internes sans atteindre aucune des surfaces du Circuit Imprim\u00e9. Comme pour les microvias aveugles, il est recommand\u00e9 de maintenir un faible rapport d&rsquo;aspect et de limiter leur port\u00e9e \u00e0 une seule couche pour garantir la fiabilit\u00e9 et faciliter la fabrication. Ces vias sont remplis de cuivre, soit par un proc\u00e9d\u00e9 de placage avec du cuivre pur, soit avec une r\u00e9sine \u00e9poxy + cuivre, afin d&rsquo;assurer une connexion solide au niveau de la t\u00eate du microvia. Il est essentiel que le proc\u00e9d\u00e9 de placage utilis\u00e9 produise des structures exemptes de vides pour une fiabilit\u00e9 maximale.   <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1542\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1542\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Microvias empil\u00e9s ou d\u00e9cal\u00e9s <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1542\" class=\"elementor-element elementor-element-bd72bac e-con-full e-flex e-con e-child\" data-id=\"bd72bac\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9d328b4 elementor-widget elementor-widget-text-editor\" data-id=\"9d328b4\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Les microvias empil\u00e9s cr\u00e9ent davantage d&rsquo;espace pour le routage haute densit\u00e9 et le fanout des BGAs \u00e0 faible pas, mais ils augmentent le co\u00fbt du Circuit Imprim\u00e9. Ils ne doivent \u00eatre utilis\u00e9s que lorsque la conception ne permet pas d&#8217;employer des microvias d\u00e9cal\u00e9s. Les microvias empil\u00e9s sur des vias enterr\u00e9s n\u00e9cessitent un proc\u00e9d\u00e9 suppl\u00e9mentaire de placage de capot en cuivre pour les vias enterr\u00e9s, tandis que les microvias empil\u00e9s sur d&rsquo;autres microvias requi\u00e8rent un remplissage en cuivre des microvias des couches internes.  <\/p>\n<p>Le proc\u00e9d\u00e9 couche par couche pour former des microvias \u00e0 faible rapport d&rsquo;aspect les rend utiles dans les applications empil\u00e9es. Les microvias empil\u00e9s sont simplement des empilements de vias enterr\u00e9s ou un microvia aveugle superpos\u00e9 \u00e0 des microvias enterr\u00e9s. C&rsquo;est la m\u00e9thode standard pour traverser plusieurs couches dans un Circuit Imprim\u00e9 HDI. Les microvias enterr\u00e9s internes dans l&#8217;empilement doivent \u00eatre remplis de p\u00e2te conductrice et plaqu\u00e9s pour assurer un contact solide lors du d\u00e9p\u00f4t et du placage du via suivant. L&rsquo;alternative aux microvias empil\u00e9s est les microvias d\u00e9cal\u00e9s, o\u00f9 les microvias des couches successives sont d\u00e9cal\u00e9s les uns par rapport aux autres.    <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7f4708b e-con-full e-flex e-con e-child\" data-id=\"7f4708b\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-637d750 elementor-widget elementor-widget-heading\" data-id=\"637d750\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Fabrication des Microvias HDI<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-dda11d8 elementor-widget elementor-widget-text-editor\" data-id=\"dda11d8\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Selon la taille des vias, ceux-ci peuvent \u00eatre perc\u00e9s m\u00e9caniquement et m\u00e9tallis\u00e9s (suivis d&rsquo;un empilement et d&rsquo;une presse de chaque couche), ou form\u00e9s \u00e0 l&rsquo;aide d&rsquo;un laser haute puissance. Ce dernier proc\u00e9d\u00e9, en constante am\u00e9lioration, est privil\u00e9gi\u00e9 dans la fabrication en volume de Circuits Imprim\u00e9s gr\u00e2ce \u00e0 son rendement \u00e9lev\u00e9. Les progr\u00e8s r\u00e9cents en techniques de per\u00e7age laser permettent d\u00e9sormais d&rsquo;atteindre des tailles de microvias aussi petites que 15 \u00b5m.  <\/p>\n<p>Apr\u00e8s le per\u00e7age et le nettoyage, le via est m\u00e9tallis\u00e9, soit par pulv\u00e9risation cathodique, d\u00e9p\u00f4t \u00e9lectrolytique, ou un proc\u00e9d\u00e9 de placage de cuivre sans \u00e9lectrolyse. L&rsquo;objectif du placage est d&rsquo;\u00e9viter la formation de vides, creux, bosses ou tout autre d\u00e9faut structurel dans le via rempli. Les vides constituent \u00e9galement un probl\u00e8me de fiabilit\u00e9, car les contraintes peuvent se concentrer autour du bord du vide o\u00f9 le cuivre est plus mince en cas de sollicitation m\u00e9canique de la structure du via.  <\/p>\n<p>Lors de la fabrication, les microvias perc\u00e9s au laser pr\u00e9sentent un risque plus faible de d\u00e9fauts de fabrication que les vias classiques. Les microvias perc\u00e9s m\u00e9caniquement peuvent pr\u00e9senter des d\u00e9fauts dus aux vibrations de la m\u00e8che avec l&rsquo;usure, et le per\u00e7age m\u00e9canique des microvias n&rsquo;est efficace que pour des diam\u00e8tres de 6 \u00e0 8 mil (0,15 \u00e0 0,20 mm), selon l&rsquo;outillage du fabricant. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-eccaebb e-flex e-con-boxed e-con e-parent\" data-id=\"eccaebb\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-61e1003 e-con-full e-flex e-con e-child\" data-id=\"61e1003\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-be412c6 elementor-widget elementor-widget-heading\" data-id=\"be412c6\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Microvias remplis ou non remplis<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d5b1901 elementor-widget elementor-widget-text-editor\" data-id=\"d5b1901\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Il est possible de remplir les microvias avec du cuivre ou de les laisser non remplis. Pour les microvias enterr\u00e9s, il est n\u00e9cessaire de remplir le trou de via avec du cuivre, surtout s&rsquo;ils doivent \u00eatre empil\u00e9s. Tout vide \u00e0 l&rsquo;int\u00e9rieur du via peut entra\u00eener une rupture pr\u00e9matur\u00e9e pendant le refusionnement. Bien qu&rsquo;il soit possible de laisser les microvias aveugles non remplis, les microvias aveugles situ\u00e9s sous les pastilles doivent toujours \u00eatre remplis.   <\/p>\n<p>Apr\u00e8s le remplissage, le fabricant plaquera le microvia. Il utilise g\u00e9n\u00e9ralement une r\u00e9sine \u00e9poxy et cuivre ou du cuivre pur pour ce proc\u00e9d\u00e9. En commen\u00e7ant par un rev\u00eatement conforme, le fabricant utilise g\u00e9n\u00e9ralement un placage puls\u00e9 pour remplir le corps du microvia avec du cuivre solide, \u00e9liminant ainsi les vides. Des additifs dans le mat\u00e9riau de remplissage sont n\u00e9cessaires pendant le placage, car leur absence peut entra\u00eener la formation de vides. Une autre raison d&rsquo;utiliser des additifs est d&rsquo;\u00e9viter que le cuivre ne se concentre sur les parois et la surface sup\u00e9rieure du microvia. Un d\u00e9p\u00f4t in\u00e9gal de cuivre le long du corps du via peut \u00e9galement r\u00e9sulter d&rsquo;un placage conforme, ce qui peut conduire \u00e0 la formation de vides.     <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-226e469 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"226e469\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/fr\/demander-un-devis\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Demander un devis<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-cbe5fde e-flex e-con-boxed e-con e-parent\" data-id=\"cbe5fde\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-cfc23de e-con-full e-flex e-con e-child\" data-id=\"cfc23de\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a0be8b4 elementor-widget elementor-widget-heading\" data-id=\"a0be8b4\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Options de remplissage des vias<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-dfcc0e9 e-con-full e-flex e-con e-child\" data-id=\"dfcc0e9\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c840274 elementor-widget elementor-widget-text-editor\" data-id=\"c840274\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Pour rappel, un via est un trou plaqu\u00e9 de cuivre utilis\u00e9 pour connecter deux couches ou plus dans un Circuit Imprim\u00e9. Le remplissage de via est une technique sp\u00e9ciale de fabrication de Circuits Imprim\u00e9s utilis\u00e9e pour obturer s\u00e9lectivement et compl\u00e8tement les trous de via avec de l&rsquo;\u00e9poxy. Il existe de nombreuses situations o\u00f9 un concepteur de Circuits Imprim\u00e9s peut souhaiter faire remplir un via. Parmi les principaux avantages :   <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7e96be5 e-grid e-con-full e-con e-child\" data-id=\"7e96be5\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-622837b e-con-full e-flex e-con e-child\" data-id=\"622837b\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-84970e4 elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"84970e4\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"80\" height=\"80\" viewBox=\"0 0 80 80\" fill=\"none\"><path d=\"M10 13.7594L40.0143 5L70 13.7594V31.7228C70 50.6037 57.917 67.3657 40.0043 73.3342C22.0868 67.3658 10 50.6 10 31.7145V13.7594Z\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linejoin=\"round\"><\/path><path d=\"M39.916 24.9155V51.5822\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M26.582 38.2485H53.2487\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tMontage en surface plus fiable\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/div>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f80703e e-con-full e-flex e-con e-child\" data-id=\"f80703e\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-86312ae elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"86312ae\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"80\" height=\"80\" viewBox=\"0 0 80 80\" fill=\"none\"><path d=\"M65 10H15C12.2386 10 10 12.2386 10 15V65C10 67.7615 12.2386 70 15 70H65C67.7615 70 70 67.7615 70 65V15C70 12.2386 67.7615 10 65 10Z\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linejoin=\"round\"><\/path><path d=\"M22.4023 49.7243L31.8305 40.2962L39.1438 47.5923L56.6693 30\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M43.334 30H56.6673V43.3333\" stroke=\"#2C53A2\" stroke-width=\"4\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tRendement d'assemblage accru\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/div>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-977a682 e-con-full e-flex e-con e-child\" data-id=\"977a682\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c3314ae elementor-view-default elementor-position-top elementor-mobile-position-top elementor-widget elementor-widget-icon-box\" data-id=\"c3314ae\" data-element_type=\"widget\" data-widget_type=\"icon-box.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-box-wrapper\">\n\n\t\t\t\t\t\t<div class=\"elementor-icon-box-icon\">\n\t\t\t\t<span  class=\"elementor-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"80\" height=\"80\" viewBox=\"0 0 80 80\" fill=\"none\"><path d=\"M25.1919 41.5771C21.1881 46.1531 20.4804 51.7214 20.7763 55.5938C20.9168 57.4346 22.7838 58.4493 24.4984 57.7649C25.7391 57.2698 27.0979 56.6519 28.0764 55.9996C30.9609 54.0766 29.9994 52.1536 30.9609 49.2691C31.9224 46.3846 36.1563 44.0383 40.0023 44.9998C43.8483 45.9613 45.3833 49.2691 45.3833 52.1536C45.3833 55.0381 44.1689 58.3331 40.5759 59.8456C36.6128 61.5139 34.8069 59.8456 29.9994 58.8841C27.4941 58.3831 24.9889 60.5746 23.5468 62.1634C22.7301 63.0631 22.6426 64.3724 23.3509 65.3594C23.8321 66.0298 24.4528 66.7986 25.1919 67.5376C27.1149 69.4606 34.8069 75.2296 42.4989 74.2681C50.1908 73.3066 56.9213 67.5376 59.8058 60.8071C62.6903 54.0766 60.7673 46.3846 55.9598 40.6156C51.1523 34.8468 42.4989 33.8853 40.5759 33.8853C38.6529 33.8853 31.9224 33.8853 25.1919 41.5771Z\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M52.6044 37.7304L21.0728 13.6179C20.4091 13.1105 19.4608 13.1662 18.9659 13.8392C17.7778 15.4554 16.6554 18.0177 18.4598 20.4236C20.7673 23.5002 29.6771 31.3204 33.8434 34.8459\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M58.3317 43.3338L38.5664 6.99762C38.1675 6.26421 37.2794 5.92844 36.5532 6.3406C34.8087 7.3309 32.7375 9.21225 33.4029 12.1454C34.2537 15.8961 37.6337 22.5813 39.9984 27.5004\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M60 46.6664L58.4172 12.8201C58.3782 11.9867 57.7263 11.2973 56.8937 11.3505C54.8917 11.4785 52.2053 12.265 51.5217 15.1945C50.6475 18.9399 50.0232 24.5419 50 29.9998\" stroke=\"#2C53A2\" stroke-width=\"3.33333\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t\t<\/span>\n\t\t\t<\/div>\n\t\t\t\n\t\t\t\t\t\t<div class=\"elementor-icon-box-content\">\n\n\t\t\t\t\t\t\t\t\t<div class=\"elementor-icon-box-title\">\n\t\t\t\t\t\t<span  >\n\t\t\t\t\t\t\tFiabilit\u00e9 am\u00e9lior\u00e9e en r\u00e9duisant la probabilit\u00e9 de pi\u00e9geage d'air ou de liquides.\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/div>\n\t\t\t\t\n\t\t\t\t\n\t\t\t<\/div>\n\t\t\t\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-292df47 e-flex e-con-boxed e-con e-parent\" data-id=\"292df47\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-eac71c9 e-con-full e-flex e-con e-child\" data-id=\"eac71c9\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-40c9821 elementor-widget elementor-widget-image\" data-id=\"40c9821\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"1024\" height=\"814\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia.webp\" class=\"attachment-large size-large wp-image-6681\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia-300x238.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia-768x611.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/hdi-microvia-600x477.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f6f7ef8 e-con-full e-flex e-con e-child\" data-id=\"f6f7ef8\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b262bf3 elementor-widget elementor-widget-heading\" data-id=\"b262bf3\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Via en pastille<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ed39bd5 elementor-widget elementor-widget-text-editor\" data-id=\"ed39bd5\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>L&rsquo;un des plus grands avantages du remplissage de via est la possibilit\u00e9 d&rsquo;impl\u00e9menter des vias en pastille. Ce proc\u00e9d\u00e9 devient de plus en plus populaire et pr\u00e9f\u00e9r\u00e9 par rapport \u00e0 la m\u00e9thode traditionnelle \u00ab\u00a0en os de chien\u00a0\u00bb pour transf\u00e9rer le signal du BGA, \u00e0 travers le via, vers les couches internes. Dans ce proc\u00e9d\u00e9, \u00e9galement appel\u00e9 pastille active, les vias sont remplis, planaris\u00e9s et plaqu\u00e9s avec du cuivre. Bien que le proc\u00e9d\u00e9 Via-In-Pad augmente le co\u00fbt, il pr\u00e9sente des avantages significatifs par rapport \u00e0 la technologie traditionnelle des trous traversants.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-2794a51 elementor-widget elementor-widget-default\" data-id=\"2794a51\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Afficher plus<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>Principaux avantages :<\/p><ul><li>Pas de BGA plus serr\u00e9s<\/li><li>Dissipation thermique accrue<\/li><li>R\u00e9duction du nombre de couches ou de la taille de la carte, pouvant finalement r\u00e9duire les co\u00fbts<\/li><li>Densit\u00e9 de routage am\u00e9lior\u00e9e (densit\u00e9 plus \u00e9lev\u00e9e par couche)<\/li><li>Renforcement de l'adh\u00e9sion des pastilles<\/li><li>Offre aux conceptions haute fr\u00e9quence le chemin le plus court vers les condensateurs de d\u00e9couplage<\/li><li>Surmonte les probl\u00e8mes et contraintes des conceptions haute vitesse, comme la faible inductance<\/li><\/ul><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-c33de13 elementor-widget elementor-widget-n-accordion\" data-id=\"c33de13\" data-element_type=\"widget\" data-settings=\"{&quot;default_state&quot;:&quot;all_collapsed&quot;,&quot;max_items_expended&quot;:&quot;one&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]}}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2040\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2040\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Remplissage conducteur des vias <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2040\" class=\"elementor-element elementor-element-199e226 e-con-full e-flex e-con e-child\" data-id=\"199e226\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0b034fa elementor-widget elementor-widget-text-editor\" data-id=\"0b034fa\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Le remplissage conducteur des vias permet un transfert efficace des signaux \u00e9lectriques d&rsquo;un c\u00f4t\u00e9 \u00e0 l&rsquo;autre du Circuit Imprim\u00e9, tout en am\u00e9liorant ses propri\u00e9t\u00e9s de transfert thermique. Les vias remplis de mat\u00e9riaux conducteurs (g\u00e9n\u00e9ralement en cuivre ou en argent) sont particuli\u00e8rement utiles pour \u00e9vacuer une grande quantit\u00e9 de chaleur des composants, car la nature m\u00e9tallique du remplissage dissipe la chaleur des circuits int\u00e9gr\u00e9s. <\/p>\n<p>L&rsquo;\u00e9poxy charg\u00e9e d&rsquo;argent est plus \u00e9conomique et plus fr\u00e9quemment utilis\u00e9e, mais l&rsquo;\u00e9poxy conductrice en cuivre offre une bien meilleure conductivit\u00e9 thermique. Cependant, les deux solutions am\u00e9liorent la qualit\u00e9 de conduction du courant entre les vias et les couches internes du Circuit Imprim\u00e9. Il convient de noter que le remplissage conducteur des vias co\u00fbte environ cinq fois plus cher que le remplissage non conducteur.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2041\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2041\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Remplissage non conducteur des vias <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2041\" class=\"elementor-element elementor-element-2378295 e-con-full e-flex e-con e-child\" data-id=\"2378295\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5f964f7 elementor-widget elementor-widget-text-editor\" data-id=\"5f964f7\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Le remplissage non conducteur des vias suit le m\u00eame proc\u00e9d\u00e9 que le remplissage conducteur, mais il est g\u00e9n\u00e9ralement utilis\u00e9 pour emp\u00eacher la p\u00e9n\u00e9tration de soudure ou d&rsquo;autres contaminants dans le via plut\u00f4t que pour conduire la chaleur ou un signal. Il fournit \u00e9galement un support structurel pour une pastille de cuivre recouvrant le trou dans le cas d&rsquo;un via-en-pastille. Il est important de noter que les vias restent plaqu\u00e9s de cuivre et continuent donc de conduire la chaleur et les signaux \u00e9lectriques, la seule diff\u00e9rence avec les vias traditionnels \u00e9tant que l&rsquo;air dans l&rsquo;espace est remplac\u00e9 par le mat\u00e9riau de remplissage.  <\/p>\n<p>Il est toujours recommand\u00e9 d&rsquo;ajuster les coefficients de dilatation thermique (CTE) du mat\u00e9riau de remplissage des vias \u00e0 ceux du stratifi\u00e9 environnant afin d&rsquo;\u00e9viter les fractures dues aux contraintes thermiques lors de la contraction ou de l&rsquo;expansion. Comme le mat\u00e9riau de remplissage des vias chauffe et se dilate beaucoup plus rapidement que le stratifi\u00e9, cette dilatation in\u00e9gale peut provoquer l&rsquo;apparition de fissures entre la pastille et la paroi du trou. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-2042\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-2042\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><h3 class=\"e-n-accordion-item-title-text\"> Vias remplis et obtur\u00e9s par placage de cuivre <\/h3><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 21L16.927 13.0778C16.9666 13.0357 17.0334 13.0357 17.073 13.0778L24.5 21\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"34\" height=\"34\" viewBox=\"0 0 34 34\" fill=\"none\"><rect x=\"0.5\" y=\"0.5\" width=\"33\" height=\"33\" rx=\"16.5\" stroke=\"#E6E6E6\"><\/rect><path d=\"M9.5 13L16.927 20.9222C16.9666 20.9643 17.0334 20.9643 17.073 20.9222L24.5 13\" stroke=\"#585858\" stroke-width=\"1.5\" stroke-linecap=\"round\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-2042\" class=\"elementor-element elementor-element-3528ef0 e-con-full e-flex e-con e-child\" data-id=\"3528ef0\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4a71c26 elementor-widget elementor-widget-text-editor\" data-id=\"4a71c26\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>La plupart des concepteurs de Circuits Imprim\u00e9s connaissent l&rsquo;utilisation de vias remplis d&rsquo;\u00e9poxy, mais nombreux sont ceux qui ne ma\u00eetrisent pas le proc\u00e9d\u00e9 d&rsquo;obturation par placage de cuivre pour les vias traversants et\/ou microvias, car tous les fabricants de Circuits Imprim\u00e9s n&rsquo;ont pas investi dans l&rsquo;\u00e9quipement n\u00e9cessaire pour r\u00e9aliser cette op\u00e9ration.<\/p>\n<p>Benchuang Electronics a d\u00e9velopp\u00e9 un proc\u00e9d\u00e9 permettant d&rsquo;obturer par placage de cuivre des vias traversants jusqu&rsquo;\u00e0 12 mils (0,3 mm) de diam\u00e8tre, sans risque de vides, poches d&rsquo;air ou pi\u00e9geage de fluides dans les trous. Sans aucun doute, les vias obtur\u00e9s par placage offrent une conductivit\u00e9 thermique 10 fois sup\u00e9rieure \u00e0 toute autre solution de remplissage de via, ce qui en fait le choix le plus logique pour la dissipation thermique. <\/p>\n<p>De mani\u00e8re g\u00e9n\u00e9rale, lorsque le rapport d&rsquo;aspect atteint 10:1 ou que le diam\u00e8tre du via est inf\u00e9rieur \u00e0 8 mils (0,2 mm), nous recommandons l&rsquo;obturation par placage de cuivre. Cependant, certaines configurations sp\u00e9cifiques rendent le remplissage ou l&rsquo;obturation des vias particuli\u00e8rement difficile :<\/p>\n<ul>\n<li>Mat\u00e9riaux ou substrats minces (moins de 20 mils\/0,5 mm) sont plus difficiles \u00e0 planariser, car ils peuvent se d\u00e9chirer ou se d\u00e9former.<\/li>\n<li>Si un placage p\u00e9riph\u00e9rique est requis, les surfaces terminales pr\u00e9sentent une accumulation de cuivre, compliquant le traitement des pistes et espacements fins.<\/li>\n<li>Les mat\u00e9riaux PTFE\/T\u00e9flon se d\u00e9forment consid\u00e9rablement.<\/li>\n<\/ul>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-63f130c e-flex e-con-boxed e-con e-parent\" data-id=\"63f130c\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-a0f8e63 e-con-full e-flex e-con e-child\" data-id=\"a0f8e63\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-99ae510 elementor-widget elementor-widget-image\" data-id=\"99ae510\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"814\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb.webp\" class=\"attachment-large size-large wp-image-6683\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb-300x238.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb-768x611.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvia-pcb-600x477.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-92044ae e-con-full e-flex e-con e-child\" data-id=\"92044ae\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-45c07a6 elementor-widget elementor-widget-heading\" data-id=\"45c07a6\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Microvias d\u00e9cal\u00e9s<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-61684b6 elementor-widget elementor-widget-text-editor\" data-id=\"61684b6\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>\u00c0 l&rsquo;instar des microvias empil\u00e9s, les microvias d\u00e9cal\u00e9s relient \u00e9galement diff\u00e9rentes couches du Circuit Imprim\u00e9. Cependant, ils ne sont jamais en contact direct, car leurs axes de per\u00e7age sont distincts, ce qui d\u00e9cale leur position sur les couches adjacentes. <\/p>\n<p>L&rsquo;utilisation de microvias d\u00e9cal\u00e9s implique moins d&rsquo;\u00e9tapes de conception. Comme le trou perc\u00e9 n&rsquo;est pas directement au-dessus de celui de la couche inf\u00e9rieure, les microvias d\u00e9cal\u00e9s perc\u00e9s au laser ne n\u00e9cessitent pas de remplissage de cuivre. Cela simplifie la conception.  <\/p>\n<p>Lors de la conception d&rsquo;une structure \u00e0 vias d\u00e9cal\u00e9s, l&rsquo;espacement entre les trous perc\u00e9s au laser est la principale pr\u00e9occupation. La faisabilit\u00e9 du design d\u00e9pend de la distance verticale entre les centres de deux microvias adjacents. Une conception viable exige que cette s\u00e9paration verticale soit sup\u00e9rieure au diam\u00e8tre du microvia.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f2ed4e0 elementor-widget elementor-widget-default\" data-id=\"f2ed4e0\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Afficher plus<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>L'empilement de microvias exerce une pression sur les parois des vias, pouvant d\u00e9tacher le via sup\u00e9rieur de sa pastille. Ainsi, les concepteurs privil\u00e9gient une configuration d\u00e9cal\u00e9e lorsqu'ils doivent interconnecter plus de deux couches.<\/p><p>Cependant, en cas de contraintes d'espace, les vias d\u00e9cal\u00e9s peuvent ne pas convenir. Bien que moins complexes, ils occupent plus de place sur la carte. En revanche, leur d\u00e9calage minimise les probl\u00e8mes de diaphonie. Le d\u00e9calage introduit toutefois plus de discontinuit\u00e9s dans le trajet du signal, compliquant le maintien d'une imp\u00e9dance de via uniforme dans les conceptions haute vitesse.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c35dc0b e-flex e-con-boxed e-con e-parent\" data-id=\"c35dc0b\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-8943803 e-con-full e-flex e-con e-child\" data-id=\"8943803\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a2c518a elementor-widget elementor-widget-image\" data-id=\"a2c518a\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"814\" src=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb.webp\" class=\"attachment-large size-large wp-image-6682\" alt=\"\" srcset=\"https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb.webp 1024w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb-300x238.webp 300w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb-768x611.webp 768w, https:\/\/hdicircuitboard.com\/wp-content\/uploads\/2025\/01\/microvias-pcb-600x477.webp 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-207a98d e-con-full e-flex e-con e-child\" data-id=\"207a98d\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0a75114 elementor-widget elementor-widget-heading\" data-id=\"0a75114\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Microvias empil\u00e9s<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b1acbb3 elementor-widget elementor-widget-text-editor\" data-id=\"b1acbb3\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<p>Les vias empil\u00e9s sont positionn\u00e9s directement les uns sur les autres. Chaque via est perc\u00e9 et plaqu\u00e9 avant d&rsquo;\u00eatre empil\u00e9 pour connecter diff\u00e9rentes couches. Ils utilisent deux anneaux de raccordement \u00e9troits : un en surface pour un positionnement pr\u00e9cis, et un en dessous pour la connexion \u00e9lectrique.   <\/p>\n<p>Les vias empil\u00e9s sont remplis de cuivre \u00e9lectrolytique, assurant \u00e0 la fois un support structurel et une connexion \u00e9lectrique solide. Toutefois, un d\u00e9p\u00f4t incorrect peut cr\u00e9er des d\u00e9fauts (vides, mauvaise adh\u00e9rence entre la base du via et la pastille cible), compromettant la fiabilit\u00e9.  <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b2ffb61 elementor-widget elementor-widget-default\" data-id=\"b2ffb61\" data-element_type=\"widget\" data-widget_type=\"default.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t<div class=\"readmore_wrapper\">\n\t<button class=\"readmore_btn read-more\" style=\"color:#2C53A2;\">Afficher plus<div class=\"my-icon-wrapper\" style=\"width:16px;\">\n\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"16\" height=\"17\" viewBox=\"0 0 16 17\" fill=\"none\"><path d=\"M12 9L8 13L4 9\" fill=\"#2C53A2\"><\/path><\/svg>\t\t<\/div><\/a><\/button>\n\t<div class=\"readmore_description\"><p>Si la compacit\u00e9 est leur principal avantage, les vias empil\u00e9s dans les Circuits Imprim\u00e9s HDI facilitent \u00e9galement le routage pratique. De plus, ils aident \u00e0 maintenir une imp\u00e9dance contr\u00f4l\u00e9e du signal de la source \u00e0 la destination.<\/p><p>La pression exerc\u00e9e sur l'axe Z du di\u00e9lectrique impacte la fiabilit\u00e9 en raison de l'inad\u00e9quation des CTE des mat\u00e9riaux. Par exemple, au-del\u00e0 de la temp\u00e9rature de transition vitreuse, le cuivre ne se dilate que de 16 ppm, tandis que le di\u00e9lectrique peut atteindre 200 ppm.<\/p><p>Avec une seule couche, le probl\u00e8me est mineur. Mais avec deux couches ou plus, l'\u00e9cart d\u00e9passe les tol\u00e9rances, risquant de provoquer la rupture du barillet ou des angles du microvia. C'est pourquoi les concepteurs privil\u00e9gient souvent le d\u00e9calage plut\u00f4t que l'empilement vertical.<\/p><\/div>\n\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-3cd58ab e-flex e-con-boxed e-con e-parent\" data-id=\"3cd58ab\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-0aeee15 e-con-full e-flex e-con e-child\" data-id=\"0aeee15\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-41b47ee elementor-widget elementor-widget-heading\" data-id=\"41b47ee\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">D\u00e9marrez avec les Circuits Imprim\u00e9s Microvia<\/h2>\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-dffad92 e-con-full e-flex e-con e-child\" data-id=\"dffad92\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t<div class=\"elementor-element elementor-element-2870bae e-con-full e-flex e-con e-child\" data-id=\"2870bae\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ea3c115 elementor-align-left elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"ea3c115\" data-element_type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Vias aveugles, vias enterr\u00e9s, Circuits Imprim\u00e9s Ultra HDI<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Mat\u00e9riaux de circuits imprim\u00e9s hyperfr\u00e9quence \u00e0 faible perte<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">Mat\u00e9riaux de circuits imprim\u00e9s haute vitesse \u00e0 faible perte<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f709ba6 e-con-full e-flex e-con e-child\" data-id=\"f709ba6\" data-element_type=\"container\" data-settings=\"{&quot;_ha_eqh_enable&quot;:false}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d640799 elementor-align-left elementor-icon-list--layout-traditional elementor-list-item-link-full_width elementor-widget elementor-widget-icon-list\" data-id=\"d640799\" data-element_type=\"widget\" data-widget_type=\"icon-list.default\">\n\t\t\t\t\t\t\t<ul class=\"elementor-icon-list-items\">\n\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">R-5775, R-5785, R-5795, TU-872 SLK, TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, mat\u00e9riau Tachyon 100G<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t<li class=\"elementor-icon-list-item\">\n\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-icon\">\n\t\t\t\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-circle\" viewBox=\"0 0 512 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M256 8C119 8 8 119 8 256s111 248 248 248 248-111 248-248S393 8 256 8z\"><\/path><\/svg>\t\t\t\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-icon-list-text\">EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE<\/span>\n\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t<\/ul>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cb656bd elementor-align-center elementor-widget elementor-widget-button\" data-id=\"cb656bd\" data-element_type=\"widget\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"https:\/\/hdicircuitboard.com\/fr\/demander-un-devis\/\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"25\" height=\"25\" viewBox=\"0 0 25 25\" fill=\"none\"><path d=\"M21.5 12.5H3.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><path d=\"M15.5 6.5L21.5 12.5L15.5 18.5\" stroke=\"white\" stroke-width=\"2\" stroke-linecap=\"round\" stroke-linejoin=\"round\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Demander un devis<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Microvia Vias aveugles, vias enterr\u00e9s, Circuits Imprim\u00e9s Ultra HDI Mat\u00e9riaux de circuits imprim\u00e9s hyperfr\u00e9quence \u00e0 faible perte Mat\u00e9riaux de circuits imprim\u00e9s haute vitesse \u00e0 faible perte R-5775, R-5785, R-5795, TU-872 SLK, TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, mat\u00e9riau Tachyon 100G EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6674","page","type-page","status-publish","hentry"],"blocksy_meta":{"has_hero_section":"disabled","vertical_spacing_source":"custom","content_area_spacing":"none","styles_descriptor":{"styles":{"desktop":"","tablet":"","mobile":""},"google_fonts":[],"version":6}},"_links":{"self":[{"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/pages\/6674","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/comments?post=6674"}],"version-history":[{"count":7,"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/pages\/6674\/revisions"}],"predecessor-version":[{"id":6943,"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/pages\/6674\/revisions\/6943"}],"wp:attachment":[{"href":"https:\/\/hdicircuitboard.com\/fr\/wp-json\/wp\/v2\/media?parent=6674"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}